Hello Linus,
Please find thermal-soc changes for v4.17-rc1.
Rui asked me to send the pull request directly to you
as we are close to the end of the merge window.
Essentially this pull removes the series that caused
warning regression. I will work with the developer
to get that fixed later on, but I am still sending
the other few patches that are unrelated to that.
Let me know if this causes any issues and can still
be pulled.
Changelog:
- New i.MX7 thermal sensor
- Mediatek driver now supports MT7622 SoC
- Removal of min max cpu cooling DT property
Differences in V3:
- Rebased on top current linus/master, to avoid and merge issues
from previous pulled thermal code.
Differences in V2:
- Reordered the patches to drop exynos changes for now until we get
agreement on the fix on that driver for the compilation warns
caused by the confusing conversion functions.
The following changes since commit 48023102b7078a6674516b1fe0d639669336049d:
Merge branch 'overlayfs-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-13 16:55:41 -0700)
are available in the git repository at:
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal linus
for you to fetch changes up to 15a32df1918259be6c23fc36014fc26ee66c836c:
dt-bindings: thermal: Remove "cooling-{min|max}-level" properties (2018-04-14 09:37:55 -0700)
----------------------------------------------------------------
Anson Huang (1):
thermal: imx: add i.MX7 thermal sensor support
Bartlomiej Zolnierkiewicz (1):
dt-bindings: thermal: remove no longer needed samsung thermal properties
Sean Wang (2):
dt-bindings: thermal: add binding for MT7622 SoC
thermal: mediatek: add support for MT7622 SoC
Viresh Kumar (1):
dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
.../devicetree/bindings/thermal/exynos-thermal.txt | 23 +-
.../devicetree/bindings/thermal/imx-thermal.txt | 9 +-
.../bindings/thermal/mediatek-thermal.txt | 1 +
.../devicetree/bindings/thermal/thermal.txt | 16 +-
drivers/thermal/imx_thermal.c | 295 ++++++++++++++++-----
drivers/thermal/mtk_thermal.c | 35 +++
6 files changed, 281 insertions(+), 98 deletions(-)
Hi, Eduardo,
On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> Hello Linus,
>
> Please find thermal-soc changes for v4.17-rc1.
> Rui asked me to send the pull request directly to you
> as we are close to the end of the merge window.
> Essentially this pull removes the series that caused
> warning regression. I will work with the developer
> to get that fixed later on, but I am still sending
> the other few patches that are unrelated to that.
> Let me know if this causes any issues and can still
> be pulled.
>
> Changelog:
> - New i.MX7 thermal sensor
> - Mediatek driver now supports MT7622 SoC
> - Removal of min max cpu cooling DT property
>
> Differences in V3:
> - Rebased on top current linus/master, to avoid and merge issues
> from previous pulled thermal code.
>
> Differences in V2:
> - Reordered the patches to drop exynos changes for now until we get
> agreement on the fix on that driver for the compilation warns
> caused by the confusing conversion functions.
>
>
> The following changes since commit
> 48023102b7078a6674516b1fe0d639669336049d:
>
> Merge branch 'overlayfs-linus' of
> git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-
> 13 16:55:41 -0700)
>
> are available in the git repository at:
>
> git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-
> thermal linus
>
> for you to fetch changes up to
> 15a32df1918259be6c23fc36014fc26ee66c836c:
>
> dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
> (2018-04-14 09:37:55 -0700)
>
This pull request does not catch this merge window.
So do you want to split it into 2 separate pull requests, one for 4.17-
rc and another for 4.18-rc1?
> ----------------------------------------------------------------
> Anson Huang (1):
> thermal: imx: add i.MX7 thermal sensor support
>
> Bartlomiej Zolnierkiewicz (1):
> dt-bindings: thermal: remove no longer needed samsung thermal
> properties
>
> Sean Wang (2):
> dt-bindings: thermal: add binding for MT7622 SoC
> thermal: mediatek: add support for MT7622 SoC
>
> Viresh Kumar (1):
> dt-bindings: thermal: Remove "cooling-{min|max}-level"
> properties
>
IMO, together with the refreshed exynos fixes, the one from Viresh and
the one from Bartlomiej can be queued for 4.17-rc, and the others have
to wait until next merge window.
thanks,
rui
> .../devicetree/bindings/thermal/exynos-thermal.txt | 23 +-
> .../devicetree/bindings/thermal/imx-thermal.txt | 9 +-
> .../bindings/thermal/mediatek-thermal.txt | 1 +
> .../devicetree/bindings/thermal/thermal.txt | 16 +-
> drivers/thermal/imx_thermal.c | 295
> ++++++++++++++++-----
> drivers/thermal/mtk_thermal.c | 35 +++
> 6 files changed, 281 insertions(+), 98 deletions(-)
Hello,
On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> Hi, Eduardo,
>
> On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > Hello Linus,
> >
> > Please find thermal-soc changes for v4.17-rc1.
> > Rui asked me to send the pull request directly to you
> > as we are close to the end of the merge window.
> > Essentially this pull removes the series that caused
> > warning regression. I will work with the developer
> > to get that fixed later on, but I am still sending
> > the other few patches that are unrelated to that.
> > Let me know if this causes any issues and can still
> > be pulled.
> >
> > Changelog:
> > - New i.MX7 thermal sensor
> > - Mediatek driver now supports MT7622 SoC
> > - Removal of min max cpu cooling DT property
> >
> > Differences in V3:
> > - Rebased on top current linus/master, to avoid and merge issues
> > from previous pulled thermal code.
> >
> > Differences in V2:
> > - Reordered the patches to drop exynos changes for now until we get
> > agreement on the fix on that driver for the compilation warns
> > caused by the confusing conversion functions.
> >
> >
> > The following changes since commit
> > 48023102b7078a6674516b1fe0d639669336049d:
> >
> > Merge branch 'overlayfs-linus' of
> > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-
> > 13 16:55:41 -0700)
> >
> > are available in the git repository at:
> >
> > git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-
> > thermal linus
> >
> > for you to fetch changes up to
> > 15a32df1918259be6c23fc36014fc26ee66c836c:
> >
> > dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
> > (2018-04-14 09:37:55 -0700)
> >
> This pull request does not catch this merge window.
> So do you want to split it into 2 separate pull requests, one for 4.17-
> rc and another for 4.18-rc1?
OK. Yeah, I am fine with that.
>
> > ----------------------------------------------------------------
> > Anson Huang (1):
> > thermal: imx: add i.MX7 thermal sensor support
> >
> > Bartlomiej Zolnierkiewicz (1):
> > dt-bindings: thermal: remove no longer needed samsung thermal
> > properties
> >
> > Sean Wang (2):
> > dt-bindings: thermal: add binding for MT7622 SoC
> > thermal: mediatek: add support for MT7622 SoC
> >
> > Viresh Kumar (1):
> > dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > properties
> >
> IMO, together with the refreshed exynos fixes, the one from Viresh and
> the one from Bartlomiej can be queued for 4.17-rc, and the others have
> to wait until next merge window.
>
Correct, the new chip support will need to wait for the next merge
window. I have already split the patches into the two categories.
The patches removing stuff are in my -fixes branch. All the other adding
new chip support are in my -linus branch.
Now, Do you have anything for this -rc2 ? If not, I will send directly
to Linus the stuff in my -fixes branch. Let me know.
Eduardo
On 三, 2018-04-18 at 07:10 -0700, Eduardo Valentin wrote:
> Hello,
>
> On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> >
> > Hi, Eduardo,
> >
> > On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > >
> > > Hello Linus,
> > >
> > > Please find thermal-soc changes for v4.17-rc1.
> > > Rui asked me to send the pull request directly to you
> > > as we are close to the end of the merge window.
> > > Essentially this pull removes the series that caused
> > > warning regression. I will work with the developer
> > > to get that fixed later on, but I am still sending
> > > the other few patches that are unrelated to that.
> > > Let me know if this causes any issues and can still
> > > be pulled.
> > >
> > > Changelog:
> > > - New i.MX7 thermal sensor
> > > - Mediatek driver now supports MT7622 SoC
> > > - Removal of min max cpu cooling DT property
> > >
> > > Differences in V3:
> > > - Rebased on top current linus/master, to avoid and merge issues
> > > from previous pulled thermal code.
> > >
> > > Differences in V2:
> > > - Reordered the patches to drop exynos changes for now until we
> > > get
> > > agreement on the fix on that driver for the compilation warns
> > > caused by the confusing conversion functions.
> > >
> > >
> > > The following changes since commit
> > > 48023102b7078a6674516b1fe0d639669336049d:
> > >
> > > Merge branch 'overlayfs-linus' of
> > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-
> > > 04-
> > > 13 16:55:41 -0700)
> > >
> > > are available in the git repository at:
> > >
> > > git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-
> > > soc-
> > > thermal linus
> > >
> > > for you to fetch changes up to
> > > 15a32df1918259be6c23fc36014fc26ee66c836c:
> > >
> > > dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > properties
> > > (2018-04-14 09:37:55 -0700)
> > >
> > This pull request does not catch this merge window.
> > So do you want to split it into 2 separate pull requests, one for
> > 4.17-
> > rc and another for 4.18-rc1?
> OK. Yeah, I am fine with that.
>
> >
> >
> > >
> > > ----------------------------------------------------------------
> > > Anson Huang (1):
> > > thermal: imx: add i.MX7 thermal sensor support
> > >
> > > Bartlomiej Zolnierkiewicz (1):
> > > dt-bindings: thermal: remove no longer needed samsung
> > > thermal
> > > properties
> > >
> > > Sean Wang (2):
> > > dt-bindings: thermal: add binding for MT7622 SoC
> > > thermal: mediatek: add support for MT7622 SoC
> > >
> > > Viresh Kumar (1):
> > > dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > properties
> > >
> > IMO, together with the refreshed exynos fixes, the one from Viresh
> > and
> > the one from Bartlomiej can be queued for 4.17-rc, and the others
> > have
> > to wait until next merge window.
> >
> Correct, the new chip support will need to wait for the next merge
> window. I have already split the patches into the two categories.
> The patches removing stuff are in my -fixes branch. All the other
> adding
> new chip support are in my -linus branch.
>
> Now, Do you have anything for this -rc2 ? If not, I will send
> directly
> to Linus the stuff in my -fixes branch. Let me know.
>
No, I don't have anything for -rc2. so please send pull request to
Linux directly.
thanks,
rui
Hi,
On Wednesday, April 18, 2018 07:10:30 AM Eduardo Valentin wrote:
> Hello,
>
> On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> > Hi, Eduardo,
> >
> > On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > > Hello Linus,
> > >
> > > Please find thermal-soc changes for v4.17-rc1.
> > > Rui asked me to send the pull request directly to you
> > > as we are close to the end of the merge window.
> > > Essentially this pull removes the series that caused
> > > warning regression. I will work with the developer
> > > to get that fixed later on, but I am still sending
> > > the other few patches that are unrelated to that.
> > > Let me know if this causes any issues and can still
> > > be pulled.
> > >
> > > Changelog:
> > > - New i.MX7 thermal sensor
> > > - Mediatek driver now supports MT7622 SoC
> > > - Removal of min max cpu cooling DT property
> > >
> > > Differences in V3:
> > > - Rebased on top current linus/master, to avoid and merge issues
> > > from previous pulled thermal code.
> > >
> > > Differences in V2:
> > > - Reordered the patches to drop exynos changes for now until we get
> > > agreement on the fix on that driver for the compilation warns
> > > caused by the confusing conversion functions.
> > >
> > >
> > > The following changes since commit
> > > 48023102b7078a6674516b1fe0d639669336049d:
> > >
> > > ? Merge branch 'overlayfs-linus' of
> > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-
> > > 13 16:55:41 -0700)
> > >
> > > are available in the git repository at:
> > >
> > > ? git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-
> > > thermal linus
> > >
> > > for you to fetch changes up to
> > > 15a32df1918259be6c23fc36014fc26ee66c836c:
> > >
> > > ? dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
> > > (2018-04-14 09:37:55 -0700)
> > >
> > This pull request does not catch this merge window.
> > So do you want to split it into 2 separate pull requests, one for 4.17-
> > rc and another for 4.18-rc1?
>
> OK. Yeah, I am fine with that.
>
> >
> > > ----------------------------------------------------------------
> > > Anson Huang (1):
> > > ? ? ? ? ? ? thermal: imx: add i.MX7 thermal sensor support
> > >
> > > Bartlomiej Zolnierkiewicz (1):
> > > ? ? ? ? ? ? dt-bindings: thermal: remove no longer needed samsung thermal
> > > properties
> > >
> > > Sean Wang (2):
> > > ? ? ? ? ? ? dt-bindings: thermal: add binding for MT7622 SoC
> > > ? ? ? ? ? ? thermal: mediatek: add support for MT7622 SoC
> > >
> > > Viresh Kumar (1):
> > > ? ? ? ? ? ? dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > properties
> > >
> > IMO, together with the refreshed exynos fixes, the one from Viresh and
> > the one from? Bartlomiej can be queued for 4.17-rc, and the others have
> > to wait until next merge window.
> >
>
> Correct, the new chip support will need to wait for the next merge
> window. I have already split the patches into the two categories.
> The patches removing stuff are in my -fixes branch. All the other adding
> new chip support are in my -linus branch.
>
> Now, Do you have anything for this -rc2 ? If not, I will send directly
> to Linus the stuff in my -fixes branch. Let me know.
What about refreshed Exynos patches (https://lkml.org/lkml/2018/4/16/256)?
Fixes from Marek (first two patches) are quite critical (without them
booting with thermal enabled triggers critical temperature handling on
Exynos4210 SoC).
Best regards,
--
Bartlomiej Zolnierkiewicz
Samsung R&D Institute Poland
Samsung Electronics
Hello Bartlomiej,
On Thu, Apr 19, 2018 at 12:41:42PM +0200, Bartlomiej Zolnierkiewicz wrote:
>
> Hi,
>
> On Wednesday, April 18, 2018 07:10:30 AM Eduardo Valentin wrote:
> > Hello,
> >
> > On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote:
> > > Hi, Eduardo,
> > >
> > > On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote:
> > > > Hello Linus,
> > > >
> > > > Please find thermal-soc changes for v4.17-rc1.
> > > > Rui asked me to send the pull request directly to you
> > > > as we are close to the end of the merge window.
> > > > Essentially this pull removes the series that caused
> > > > warning regression. I will work with the developer
> > > > to get that fixed later on, but I am still sending
> > > > the other few patches that are unrelated to that.
> > > > Let me know if this causes any issues and can still
> > > > be pulled.
> > > >
> > > > Changelog:
> > > > - New i.MX7 thermal sensor
> > > > - Mediatek driver now supports MT7622 SoC
> > > > - Removal of min max cpu cooling DT property
> > > >
> > > > Differences in V3:
> > > > - Rebased on top current linus/master, to avoid and merge issues
> > > > from previous pulled thermal code.
> > > >
> > > > Differences in V2:
> > > > - Reordered the patches to drop exynos changes for now until we get
> > > > agreement on the fix on that driver for the compilation warns
> > > > caused by the confusing conversion functions.
> > > >
> > > >
> > > > The following changes since commit
> > > > 48023102b7078a6674516b1fe0d639669336049d:
> > > >
> > > > ? Merge branch 'overlayfs-linus' of
> > > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04-
> > > > 13 16:55:41 -0700)
> > > >
> > > > are available in the git repository at:
> > > >
> > > > ? git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-
> > > > thermal linus
> > > >
> > > > for you to fetch changes up to
> > > > 15a32df1918259be6c23fc36014fc26ee66c836c:
> > > >
> > > > ? dt-bindings: thermal: Remove "cooling-{min|max}-level" properties
> > > > (2018-04-14 09:37:55 -0700)
> > > >
> > > This pull request does not catch this merge window.
> > > So do you want to split it into 2 separate pull requests, one for 4.17-
> > > rc and another for 4.18-rc1?
> >
> > OK. Yeah, I am fine with that.
> >
> > >
> > > > ----------------------------------------------------------------
> > > > Anson Huang (1):
> > > > ? ? ? ? ? ? thermal: imx: add i.MX7 thermal sensor support
> > > >
> > > > Bartlomiej Zolnierkiewicz (1):
> > > > ? ? ? ? ? ? dt-bindings: thermal: remove no longer needed samsung thermal
> > > > properties
> > > >
> > > > Sean Wang (2):
> > > > ? ? ? ? ? ? dt-bindings: thermal: add binding for MT7622 SoC
> > > > ? ? ? ? ? ? thermal: mediatek: add support for MT7622 SoC
> > > >
> > > > Viresh Kumar (1):
> > > > ? ? ? ? ? ? dt-bindings: thermal: Remove "cooling-{min|max}-level"
> > > > properties
> > > >
> > > IMO, together with the refreshed exynos fixes, the one from Viresh and
> > > the one from? Bartlomiej can be queued for 4.17-rc, and the others have
> > > to wait until next merge window.
> > >
> >
> > Correct, the new chip support will need to wait for the next merge
> > window. I have already split the patches into the two categories.
> > The patches removing stuff are in my -fixes branch. All the other adding
> > new chip support are in my -linus branch.
> >
> > Now, Do you have anything for this -rc2 ? If not, I will send directly
> > to Linus the stuff in my -fixes branch. Let me know.
>
> What about refreshed Exynos patches (https://lkml.org/lkml/2018/4/16/256)?
Cool! Thanks for fixing that warning.
>
> Fixes from Marek (first two patches) are quite critical (without them
> booting with thermal enabled triggers critical temperature handling on
> Exynos4210 SoC).
I will include those two fixes in rc3. The other of that patch series
will go into the next merge window.
Thanks for helping me to keep track of the patches.
BR,
Eduardo