Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id ; Thu, 1 Feb 2001 01:54:33 -0500 Received: (majordomo@vger.kernel.org) by vger.kernel.org id ; Thu, 1 Feb 2001 01:54:23 -0500 Received: from mdmgrp2-6.accesstoledo.net ([207.43.107.6]:42500 "EHLO rosswinds.net") by vger.kernel.org with ESMTP id ; Thu, 1 Feb 2001 01:54:11 -0500 Date: Wed, 31 Jan 2001 01:52:54 -0500 (EST) From: "Michael B. Trausch" To: John R Lenton cc: Linux Kernel Mailing List Subject: Re: VIA IDE problems related to heat? In-Reply-To: <20010201033535.A576@grulic.org.ar> Message-ID: MIME-Version: 1.0 Content-Type: TEXT/PLAIN; charset=US-ASCII Sender: linux-kernel-owner@vger.kernel.org X-Mailing-List: linux-kernel@vger.kernel.org On Thu, 1 Feb 2001, John R Lenton wrote: > > I'm looking for confirmations on any kind of correlation between > the problems people have been having with the assorted VIA IDE > chipsets and possible overheating of said chipsets. > I used to have problems with my motherboard in nearly all operating systems if I let the system overheat. I don't know the exact temprature, but some of the chips were hot enough to literally burn me when I touched them. I run with an open case in a 40 degree room now, with minor circulation of air around the computer and I haven't had the problem ever since. I turn the PC off on days when the room temperature exceeds 80 degrees, becuase that's it's primary time to overheat. - Mike =========================================================================== Michael B. Trausch fd0man@crosswinds.net Avid Linux User since April, '96! AIM: ML100Smkr Contactable via IRC (DALNet) or AIM as ML100Smkr =========================================================================== - To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org Please read the FAQ at http://www.tux.org/lkml/