Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1755594Ab3HFOmr (ORCPT ); Tue, 6 Aug 2013 10:42:47 -0400 Received: from ns.mm-sol.com ([212.124.72.66]:39943 "EHLO extserv.mm-sol.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1754182Ab3HFOmp (ORCPT ); Tue, 6 Aug 2013 10:42:45 -0400 Message-ID: <1375800096.2027.35.camel@iivanov-dev.int.mm-sol.com> Subject: Re: [RFC 2/2] usb: dwc3: Add Qualcomm DWC3 glue layer driver From: "Ivan T. Ivanov" To: Mark Rutland Cc: "balbi@ti.com" , "rob.herring@calxeda.com" , Pawel Moll , "swarren@wwwdotorg.org" , "ian.campbell@citrix.com" , "rob@landley.net" , "gregkh@linuxfoundation.org" , "grant.likely@linaro.org" , "devicetree@vger.kernel.org" , "linux-doc@vger.kernel.org" , "linux-kernel@vger.kernel.org" , "linux-usb@vger.kernel.org" , "linux-omap@vger.kernel.org" Date: Tue, 06 Aug 2013 17:41:36 +0300 In-Reply-To: <20130806140710.GF25383@e106331-lin.cambridge.arm.com> References: <1375789991-30041-1-git-send-email-iivanov@mm-sol.com> <1375789991-30041-3-git-send-email-iivanov@mm-sol.com> <20130806140710.GF25383@e106331-lin.cambridge.arm.com> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.2.3-0ubuntu6 Content-Transfer-Encoding: 7bit Mime-Version: 1.0 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2084 Lines: 57 Hi, On Tue, 2013-08-06 at 15:07 +0100, Mark Rutland wrote: > On Tue, Aug 06, 2013 at 12:53:11PM +0100, Ivan T. Ivanov wrote: > > From: "Ivan T. Ivanov" > > What does the "glue layer" do? Is it an actual piece of hardware, or > just some platform-specific code? > It is hardware layer around Synopsys DesignWare USB3 core. The term 'glue layer' is what is used in TI OMAP's and Samsung Exynos drivers implementations. > > > > Signed-off-by: Ivan T. Ivanov > > --- > > .../devicetree/bindings/usb/msm-ssusb.txt | 39 +++++ > > drivers/usb/dwc3/Kconfig | 8 + > > drivers/usb/dwc3/Makefile | 1 + > > drivers/usb/dwc3/dwc3-msm.c | 175 ++++++++++++++++++++ > > 4 files changed, 223 insertions(+) > > create mode 100644 drivers/usb/dwc3/dwc3-msm.c > > > > diff --git a/Documentation/devicetree/bindings/usb/msm-ssusb.txt b/Documentation/devicetree/bindings/usb/msm-ssusb.txt > > index 550b496..313ae0d 100644 > > --- a/Documentation/devicetree/bindings/usb/msm-ssusb.txt > > +++ b/Documentation/devicetree/bindings/usb/msm-ssusb.txt > > @@ -22,6 +22,23 @@ Required "supply-name" examples are: > > "v1p8" : 1.8v supply for SS-PHY > > "vddcx" : vdd supply for SS-PHY digital circuit operation > > > > +Required properties : > > +- compatible : should be "qcom,dwc-usb3-msm" > > +- reg : offset and length of the register set in the memory map > > + offset and length of the TCSR register for routing USB > > + signals to either picoPHY0 or picoPHY1. > > +- clocks = <&usb30_master_cxc>, <&sys_noc_usb3_axi_cxc>, <&usb30_sleep_cxc>, <&usb30_mock_utmi_cxc>; > > Similarly to my comment on patch 1, these need to be described better. Sure, will fix this. Thanks, Ivan > > Thanks, > Mark. -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/