Date: Fri, 9 Aug 2013 16:32:13 +0300
From: Felipe Balbi <balbi@ti.com>
To: "Ivan T. Ivanov" <iivanov@mm-sol.com>
CC: <balbi@ti.com>, <rob.herring@calxeda.com>, <pawel.moll@arm.com>,
        <mark.rutland@arm.com>, <swarren@wwwdotorg.org>,
        <ian.campbell@citrix.com>, <rob@landley.net>,
        <gregkh@linuxfoundation.org>, <grant.likely@linaro.org>,
        <idos@codeaurora.org>, <mgautam@codeaurora.org>,
        <devicetree@vger.kernel.org>, <linux-doc@vger.kernel.org>,
        <linux-kernel@vger.kernel.org>, <linux-usb@vger.kernel.org>,
        <linux-omap@vger.kernel.org>, <linux-arm-msm@vger.kernel.org>
Subject: Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver
Message-ID: <20130809133213.GJ12041@radagast>
Reply-To: <balbi@ti.com>
References: <1376042027-9798-1-git-send-email-iivanov@mm-sol.com>
 <1376042027-9798-4-git-send-email-iivanov@mm-sol.com>
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On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote:
> From: "Ivan T. Ivanov" <iivanov@mm-sol.com>
>=20
> DWC3 glue layer is hardware layer around Synopsys DesignWare
> USB3 core. Its purpose is to supply Synopsys IP with required
> clocks, voltages and interface it with the rest of the SoC.
>=20
> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>

same comments from previous version.

--=20
balbi

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