Message-ID: <1376061400.6143.1.camel@debian>
Subject: Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer
 driver
From: "Ivan T. Ivanov" <iivanov@mm-sol.com>
To: balbi@ti.com
Cc: rob.herring@calxeda.com, pawel.moll@arm.com, mark.rutland@arm.com,
        swarren@wwwdotorg.org, ian.campbell@citrix.com, rob@landley.net,
        gregkh@linuxfoundation.org, grant.likely@linaro.org,
        idos@codeaurora.org, mgautam@codeaurora.org,
        devicetree@vger.kernel.org, linux-doc@vger.kernel.org,
        linux-kernel@vger.kernel.org, linux-usb@vger.kernel.org,
        linux-omap@vger.kernel.org, linux-arm-msm@vger.kernel.org
Date: Fri, 09 Aug 2013 11:16:40 -0400
In-Reply-To: <20130809133213.GJ12041@radagast>
References: <1376042027-9798-1-git-send-email-iivanov@mm-sol.com>
	 <1376042027-9798-4-git-send-email-iivanov@mm-sol.com>
	 <20130809133213.GJ12041@radagast>
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Sender: linux-kernel-owner@vger.kernel.org
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Hi, 

On Fri, 2013-08-09 at 16:32 +0300, Felipe Balbi wrote:
> On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote:
> > From: "Ivan T. Ivanov" <iivanov@mm-sol.com>
> > 
> > DWC3 glue layer is hardware layer around Synopsys DesignWare
> > USB3 core. Its purpose is to supply Synopsys IP with required
> > clocks, voltages and interface it with the rest of the SoC.
> > 
> > Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
> 
> same comments from previous version.
> 

Sorry, I have somehow missed Your email.
I will address them shortly.

Regard,
Ivan

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