Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1756395Ab3H3NVO (ORCPT ); Fri, 30 Aug 2013 09:21:14 -0400 Received: from mga01.intel.com ([192.55.52.88]:62855 "EHLO mga01.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1756345Ab3H3NVL convert rfc822-to-8bit (ORCPT ); Fri, 30 Aug 2013 09:21:11 -0400 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="4.89,990,1367996400"; d="scan'208";a="394520372" From: "R, Durgadoss" To: Eduardo Valentin CC: "Zhang, Rui" , "linux-pm@vger.kernel.org" , "linux-kernel@vger.kernel.org" , "hongbo.zhang@linaro.org" , "wni@nvidia.com" Subject: RE: [PATCHv3 0/8] Thermal Framework Enhancements Thread-Topic: [PATCHv3 0/8] Thermal Framework Enhancements Thread-Index: AQHOpO9fn2+fS6U/+ka5UqqQQPExz5mtTpLAgAAF2QCAAGbFUA== Date: Fri, 30 Aug 2013 13:21:06 +0000 Message-ID: <4D68720C2E767A4AA6A8796D42C8EB59D4DA0E@BGSMSX101.gar.corp.intel.com> References: <1360061183-14137-1-git-send-email-durgadoss.r@intel.com> <521FA335.2060309@ti.com> <4D68720C2E767A4AA6A8796D42C8EB59D4D3F8@BGSMSX101.gar.corp.intel.com> <5220914A.3070107@ti.com> In-Reply-To: <5220914A.3070107@ti.com> Accept-Language: en-US Content-Language: en-US X-MS-Has-Attach: X-MS-TNEF-Correlator: x-originating-ip: [10.223.10.10] Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 8BIT MIME-Version: 1.0 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 6244 Lines: 153 > -----Original Message----- > From: linux-pm-owner@vger.kernel.org [mailto:linux-pm- > owner@vger.kernel.org] On Behalf Of Eduardo Valentin > Sent: Friday, August 30, 2013 6:04 PM > To: R, Durgadoss > Cc: Eduardo Valentin; Zhang, Rui; linux-pm@vger.kernel.org; linux- > kernel@vger.kernel.org; hongbo.zhang@linaro.org; wni@nvidia.com > Subject: Re: [PATCHv3 0/8] Thermal Framework Enhancements > > On 30-08-2013 05:20, R, Durgadoss wrote: > > Hi Eduardo, > > > >> -----Original Message----- > >> From: Eduardo Valentin [mailto:eduardo.valentin@ti.com] > >> Sent: Friday, August 30, 2013 1:08 AM > >> To: R, Durgadoss > >> Cc: Zhang, Rui; linux-pm@vger.kernel.org; linux-kernel@vger.kernel.org; > >> eduardo.valentin@ti.com; hongbo.zhang@linaro.org; wni@nvidia.com > >> Subject: Re: [PATCHv3 0/8] Thermal Framework Enhancements > >> > >> Durga, > >> > >> On 05-02-2013 06:46, Durgadoss R wrote: > >>> This patch set is a v3 of the previous versions submitted here: > >>> [v2]: http://lwn.net/Articles/531720/ > >>> [v1]: https://lkml.org/lkml/2012/12/18/108 > >>> [RFC]:https://patchwork.kernel.org/patch/1758921/ > >>> > >> > >> Long time this work is not moving forward. While writing the device tree > > > > I am trying my best to get to this, > > Will try to refresh in a couple of weeks. > > > >> parser, I thought of using your work as baseline to see how the multiple > >> sensor per zone would look like (also in DT). > >> > >> But while checking your code again, I realized that you are actually > >> creating a new API, that is probably why you named it sysfs-api2. While > >> I understand the motivation (they are pretty different), I believe this > >> is not a good thing to do. I would suggest making so that we have a > >> single API. > > > > As in the sensor APIs ? or the zone level APIs ? > > The sensor level APIs are anyway new; the zone level ones > > we have to work out a way for them. > > > > Is this what you are referring to ? Could you confirm/explain a bit more ? > > OK. Let's assume that maybe I didn't quite get your proposal then. Let > me step back and ask you what is the relation between existing > thermal_zone_device and thermal_zone? Would existing drivers be The existing thermal_zone_device would be a new thermal zone with one sensor in it. > complaint with new API? Okay got it. This is what myself & Rui discussed a while ago to address this. When these patches are merged, they will co-exist for some time. Rui had an idea to write a wrapper on top of these, which will make the existing drivers complaint with new API. This wrapper can be a Kconfig option, to select on what we need; new/existing APIs. Thanks, Durga > > > >> > >>> This patch set is based on Rui's -next tree, and is > >>> tested on a Core-i5 and an Atom netbook. > >>> > >>> Changes since v2: > >>> * Reworked the map sysfs attributes in patch [5/8] > >>> * Dropped configuration for maximum sensors and > >>> cooling devices, through Kconfig. > >>> * Added __remove_trip_attr method > >>> * Renamed __clean_map_entry to __remove_map_entry > >>> for consistency in naming. > >>> Changes Since v1: > >>> * Removed kobject creation for thermal_trip and thermal_map > >>> nodes as per Greg-KH's comments. > >>> * Added ABI Documentation under 'testing'. > >>> * Modified the GET_INDEX macro to be more linux-like, thanks > >>> to Joe Perches. > >>> * Added get_[sensor/cdev]_by_name APIs to thermal.h > >>> > >>> This series contains 8 patches: > >>> Patch 1/8: Creates new sensor level APIs > >>> Patch 2/8: Creates new zone level APIs. The existing tzd structure is > >>> kept as such for clarity and compatibility purposes. > >>> Patch 3/8: Creates functions to add/remove a cdev to/from a zone. The > >>> existing tcd structure need not be modified. > >>> Patch 4/8: Adds sensorX_trip_[active/passive/hot/critical] sysfs nodes, > >>> under /sys/class/thermal/zoneY/. This exposes various trip > >>> points for sensorX present in zoneY. > >>> Patch 5/8: Adds mapY_* sysfs node. These attributes represent > >>> the binding relationship between a sensor and a cdev, > >>> within a zone. > >>> Patch 6/8: Creates Documentation for the new APIs. A new file is > >>> created for clarity. Final goal is to merge with the existing > >>> file or refactor the files, as whatever seems appropriate. > >>> Patch 7/8: Add ABI documentation for sysfs interfaces introduced in this > patch. > >>> Patch 8/8: A dummy driver that can be used for testing. This is not for merge. > >>> > >>> Durgadoss R (8): > >>> Thermal: Create sensor level APIs > >>> Thermal: Create zone level APIs > >>> Thermal: Add APIs to bind cdev to new zone structure > >>> Thermal: Add trip point sysfs nodes for sensor > >>> Thermal: Create Thermal map sysfs attributes for a zone > >>> Thermal: Add Documentation to new APIs > >>> Thermal: Add ABI Documentation for sysfs interfaces > >>> Thermal: Dummy driver used for testing > >>> > >>> Documentation/ABI/testing/sysfs-class-thermal | 137 ++++ > >>> Documentation/thermal/sysfs-api2.txt | 247 ++++++ > >>> drivers/thermal/Kconfig | 5 + > >>> drivers/thermal/Makefile | 2 + > >>> drivers/thermal/thermal_sys.c | 994 > +++++++++++++++++++++++++ > >>> drivers/thermal/thermal_test.c | 324 ++++++++ > >>> include/linux/thermal.h | 123 ++- > >>> 7 files changed, 1831 insertions(+), 1 deletion(-) > >>> create mode 100644 Documentation/ABI/testing/sysfs-class-thermal > >>> create mode 100644 Documentation/thermal/sysfs-api2.txt > >>> create mode 100644 drivers/thermal/thermal_test.c > >>> > >> > >> > >> -- > >> You have got to be excited about what you are doing. (L. Lamport) > >> > >> Eduardo Valentin > > > > > > > > > -- > You have got to be excited about what you are doing. (L. Lamport) > > Eduardo Valentin -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/