From: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
To: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: Zhang Rui <rui.zhang@intel.com>, linux-pm@vger.kernel.org,
        linux-kernel@vger.kernel.org,
        Kyungmin Park <kyungmin.park@samsung.com>,
        Arnd Bergmann <arnd@arndb.de>
Subject: Re: [PATCH] thermal: offer TI thermal support only when ARCH_OMAP2PLUS
 is defined
Date: Tue, 08 Oct 2013 19:40:48 +0200
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On Tuesday, October 08, 2013 06:59:19 PM Bartlomiej Zolnierkiewicz wrote:

[...]

> > Restricting drivers to be compiled to specific architecture is a poor
> > design strategy. Specifically, on the TI Bandgap device driver, as I
> > already mentioned to you, this is again clear, as it is currently used
> > on different archs, and the code can be easily reused when other archs,
> > different than DRA and OMAP, need it.
> 
> It is the correct strategy to restrict hardware specific device drivers
> (i.e. ARM Exynos thermal driver) to be compiled only for hardware that
> it is available on (i.e. ARM Exynos SoCs). If TI bandgap driver is not
> hardware specific and can be used on non TI hardware than you're of
> course right.

Just small addition. We are not using TI bandgap IP in any current ARM
Samsung SoCs so TI bandgap IP support should not be available on them
(=> we should not use ARCH_HAS_BANDGAP at all, usage for EXYNOS_THERMAL
is incorrect as I already explained in previous mail).

OTOH archs/SoCs that are using such IP can select ARCH_HAS_BANDGAP freely.

Best regards,
--
Bartlomiej Zolnierkiewicz
Samsung R&D Institute Poland
Samsung Electronics

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