Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1754576AbaDWM3I (ORCPT ); Wed, 23 Apr 2014 08:29:08 -0400 Received: from ns.mm-sol.com ([37.157.136.199]:56630 "EHLO extserv.mm-sol.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751800AbaDWM3C (ORCPT ); Wed, 23 Apr 2014 08:29:02 -0400 From: "Ivan T. Ivanov" To: Peter Chen Cc: "Ivan T. Ivanov" , Greg Kroah-Hartman , linux-kernel@vger.kernel.org, linux-usb@vger.kernel.org, linux-arm-msm@vger.kernel.org Subject: [PATCH v4 0/3] usb: chipidea: msm: Clean and fix glue layer driver Date: Wed, 23 Apr 2014 15:28:01 +0300 Message-Id: <1398256084-6815-1-git-send-email-iivanov@mm-sol.com> X-Mailer: git-send-email 1.8.3.2 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org From: "Ivan T. Ivanov" This series intend to fix driver, which was broken for a while. It is used to create peripheral role device, which in coordination with phy-usb-msm driver could provide USB2.0 gadget support for Qualcomm targets. Changes since version 3. - Fix typo in devicetree description file. Previews version can be found here: https://lkml.org/lkml/2014/4/22/195 Ivan T. Ivanov (3): usb: chipidea: msm: Add device tree binding information usb: chipidea: msm: Add device tree support usb: chipidea: msm: Initialize offset of the capability registers .../devicetree/bindings/usb/ci-hdrc-qcom.txt | 17 +++++++++++++++ drivers/usb/chipidea/ci_hdrc_msm.c | 24 +++++++++++++++++++++- 2 files changed, 40 insertions(+), 1 deletion(-) create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt -- 1.8.3.2 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/