Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S933803AbbBJAhv (ORCPT ); Mon, 9 Feb 2015 19:37:51 -0500 Received: from mail-pd0-f172.google.com ([209.85.192.172]:38234 "EHLO mail-pd0-f172.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932686AbbBJAhr (ORCPT ); Mon, 9 Feb 2015 19:37:47 -0500 From: Eduardo Valentin To: Rui Zhang , ezequiel.garcia@free-electrons.com, amit.kachhap@linaro.org, viresh.kumar@linaro.org, amit.daniel@samsung.com, hongbo.zhang@linaro.com, andrew@lunn.ch, durgadoss.r@intel.com, peter@piie.net, shawn.guo@linaro.org, aaron.lu@intel.com, caesar.wang@rock-chips.com, b.zolnierkie@samsung.com, l.majewski@samsung.com, vincenzo.frascino@st.com, mperttunen@nvidia.com, mikko.perttunen@kapsi.fi, srinivas.pandruvada@linux.intel.com, jacob.jun.pan@linux.intel.com, bcousson@baylibre.com Cc: LKML , Linux PM , Eduardo Valentin Subject: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook Date: Mon, 9 Feb 2015 17:34:02 -0400 Message-Id: <1423517653-11359-2-git-send-email-edubezval@gmail.com> X-Mailer: git-send-email 2.1.3 In-Reply-To: <1423517653-11359-1-git-send-email-edubezval@gmail.com> References: <1423517653-11359-1-git-send-email-edubezval@gmail.com> Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 4896 Lines: 127 This patch adds a book about the Linux Kernel Thermal Framework. In this change, only a brief introduction is added together with Makefile changes. Signed-off-by: Eduardo Valentin --- Documentation/DocBook/Makefile | 3 +- Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ 2 files changed, 90 insertions(+), 1 deletion(-) create mode 100644 Documentation/DocBook/thermal.tmpl diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile index 9c7d92d..8163508 100644 --- a/Documentation/DocBook/Makefile +++ b/Documentation/DocBook/Makefile @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ 80211.xml debugobjects.xml sh.xml regulator.xml \ alsa-driver-api.xml writing-an-alsa-driver.xml \ tracepoint.xml drm.xml media_api.xml w1.xml \ - writing_musb_glue_layer.xml crypto-API.xml + writing_musb_glue_layer.xml crypto-API.xml thermal.xml + writing_musb_glue_layer.xml include Documentation/DocBook/media/Makefile diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl new file mode 100644 index 0000000..f8fb8a2 --- /dev/null +++ b/Documentation/DocBook/thermal.tmpl @@ -0,0 +1,88 @@ + + + + + + Linux Kernel Thermal Framework API + + + + Eduardo + Valentin + +
+ evalenti@kernel.org +
+ + + + + + 2008-2014 + Eduardo Valentin + Sujith Thomas + Zhang Rui + + + + This documentation is free software; you can redistribute + it and/or modify it under the terms of the GNU General Public + License version 2 as published by the Free Software Foundation. + + + + This program is distributed in the hope that it will be + useful, but WITHOUT ANY WARRANTY; without even the implied + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. + See the GNU General Public License for more details. + + + + For more details see the file COPYING in the source + distribution of Linux. + + + + + + + + Introduction + Thermal management is any method or technique implied to + mitigate emergencies caused by operating devices within + unsupported temperatures. The challenge consists of designing a + product keeping the junction temperature of the IC components. + The operating temperature of IC components used on products must + operate within their design limits. Besides, temperature towards + device enclosure must be in a comfort level for the user. + Therefore, thermal management, by the time of this writing, + starts in very early device design phase. Managing thermal may + involve different disciplines, at different stages, such as + temperature monitoring, floorplanning, microarchitectural + techniques, compiler techniques, OS techniques, liquid cooling, + and thermal reliability or security. This document covers what + the Linux Kernel Thermal Framework provides as abstraction to + users with respect to thermal management. + + One of the first proposals to provide a solution to cover + the thermal problem appears in the Advanced Configuration and + Power Interface (ACPI) specification. ACPI provides an open + standard for device configuration and power management by the + operating system. However, several computing devices which may + have thermal issues in the market disregard the ACPI standard. + Therefore, the Linux Kernel Thermal Framework has been designed + to serve as abstraction for ACPI and non-ACPI systems. The core + concepts applies in both types of systems. + + The Linux Kernel Thermal Framework has a design which + represents the different thermal constraints found in an + end-products. The thermal constraints exist to serve different + purposes. There two major types of thermal constraints. The + first is related to components junction temperature. The second + is related to the level of comfort while end users are handling + devices. + + + + -- 2.1.3 -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/