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From: Eduardo Valentin <edubezval@gmail.com>
To: Rui Zhang <rui.zhang@intel.com>, ezequiel.garcia@free-electrons.com,
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Cc: LKML <linux-kernel@vger.kernel.org>, Linux PM <linux-pm@vger.kernel.org>,
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Subject: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary
Date: Mon,  9 Feb 2015 17:34:03 -0400
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Content-Length: 4904
Lines: 154

This change introduces a section in the Introduction Chapter to
list concepts used by the Thermal Framework.

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
---
 Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++-
 1 file changed, 128 insertions(+), 1 deletion(-)

diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl
index f8fb8a2..66efed3 100644
--- a/Documentation/DocBook/thermal.tmpl
+++ b/Documentation/DocBook/thermal.tmpl
@@ -84,5 +84,132 @@
 		devices.
 		</para>
 
-  </chapter>
+		<sect1 id="glossary">
+			<title>Glossary</title>
+			<para>The Linux Kernel Thermal Framework  uses a
+			specific terminology to represent the entities involved
+			in thermal constrained environments. This section
+			summaries the terminology as dictionary. These terms are
+			in use within the present document and in the source
+			code of the Linux Kernel Thermal Framework.
+			</para>
+			<glossary>
+				<glossentry>
+					<glossterm>Thermal Zone</glossterm>
+					<glossdef>
+						<para>Thermal zones represent
+						what is the current status of a
+						thermal constrained zone in the
+						hardware. The zone usually is a
+						device or component. The status
+						of a thermal zone is mainly with
+						respect to temperature.
+						Currently, the Linux Kernel
+						Thermal Framework represents
+						temperature in miliCelsius. The
+						current abstraction covers for
+						non negative temperatures and
+						constraints.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Sensors</glossterm>
+					<glossdef>
+						<para>Thermal sensors provide
+						temperature sensing capabilities
+						on thermal zones. Typical
+						devices are I2C ADC converters
+						and bandgaps. These are nodes
+						providing temperature data to
+						thermal zones. Thermal sensor
+						devices may control one or more
+						internal sensors.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Trips Points</glossterm>
+					<glossdef>
+						<para>The trip node describes a
+						point in the temperature domain
+						in which the system takes an
+						action. This item describes just
+						the point, not the action. Trip
+						points are represented as
+						temperature in miliCelsius. The
+						current abstraction covers for
+						non negative temperatures.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Governor</glossterm>
+					<glossdef>
+						<para>Thermal Governors
+						represent a policy to manage the
+						thermal zone device temperature.
+						The governor targets to keep
+						temperature in an acceptable
+						range which correlates to the
+						power budget, while maximizing
+						the performance. Governors can
+						be implemented in Kernel Space
+						or in User Space.
+						</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Thermal Cooling Device</glossterm>
+					<glossdef>
+						<para>Cooling devices provide
+						control on power dissipation.
+						There are essentially two ways
+						to provide control on power
+						dissipation. First is by means
+						of regulating device
+						performance, which is known as
+						passive cooling. A typical
+						passive cooling is a CPU that
+						has dynamic voltage and
+						frequency scaling (DVFS), and
+						uses lower frequencies as
+						cooling states. Second is by
+						means of activating devices in
+						order to remove the dissipated
+						heat, which is known as active
+						cooling, e.g. regulating fan
+						speeds. In both cases, cooling
+						devices shall have a way to
+						determine the state of cooling
+						in which the device is.
+				</para>
+					</glossdef>
+				</glossentry>
+				<glossentry>
+					<glossterm>Cooling State</glossterm>
+					<glossdef>
+						<para>Any cooling device has a
+						range of cooling states (i.e.
+						different levels of heat
+						dissipation). For example a
+						fan's cooling states correspond
+						to the different fan speeds
+						possible. Cooling states are
+						referred to by single unsigned
+						integers, where larger numbers
+						mean greater heat dissipation.
+						The precise set of cooling
+						states associated with a device
+						(as referred to be the
+						cooling-min-state and
+						cooling-max-state properties)
+						should be defined in a
+						particular device's binding.
+						</para>
+					</glossdef>
+				</glossentry>
+			</glossary>
+		</sect1>
+	</chapter>
 </book>
-- 
2.1.3

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