Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1752347AbbBRLNX (ORCPT ); Wed, 18 Feb 2015 06:13:23 -0500 Received: from foss-mx-na.foss.arm.com ([217.140.108.86]:43926 "EHLO foss-mx-na.foss.arm.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751527AbbBRLNU (ORCPT ); Wed, 18 Feb 2015 06:13:20 -0500 Date: Wed, 18 Feb 2015 11:13:08 +0000 From: Javi Merino To: Eduardo Valentin Cc: Rui Zhang , "ezequiel.garcia@free-electrons.com" , "amit.kachhap@linaro.org" , "viresh.kumar@linaro.org" , "amit.daniel@samsung.com" , "hongbo.zhang@linaro.com" , "andrew@lunn.ch" , "durgadoss.r@intel.com" , "peter@piie.net" , "shawn.guo@linaro.org" , "aaron.lu@intel.com" , "caesar.wang@rock-chips.com" , "b.zolnierkie@samsung.com" , "l.majewski@samsung.com" , "vincenzo.frascino@st.com" , "mperttunen@nvidia.com" , "mikko.perttunen@kapsi.fi" , "srinivas.pandruvada@linux.intel.com" , "jacob.jun.pan@linux.intel.com" , "bcousson@baylibre.com" , LKML , Linux PM Subject: Re: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook Message-ID: <20150218111308.GC2990@e104805> References: <1423517653-11359-1-git-send-email-edubezval@gmail.com> <1423517653-11359-2-git-send-email-edubezval@gmail.com> MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline In-Reply-To: <1423517653-11359-2-git-send-email-edubezval@gmail.com> User-Agent: Mutt/1.5.21 (2010-09-15) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 5330 Lines: 134 On Mon, Feb 09, 2015 at 09:34:02PM +0000, Eduardo Valentin wrote: > This patch adds a book about the Linux Kernel Thermal Framework. > In this change, only a brief introduction is added together with > Makefile changes. > > Signed-off-by: Eduardo Valentin > --- > Documentation/DocBook/Makefile | 3 +- > Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ > 2 files changed, 90 insertions(+), 1 deletion(-) > create mode 100644 Documentation/DocBook/thermal.tmpl > > diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile > index 9c7d92d..8163508 100644 > --- a/Documentation/DocBook/Makefile > +++ b/Documentation/DocBook/Makefile > @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ > 80211.xml debugobjects.xml sh.xml regulator.xml \ > alsa-driver-api.xml writing-an-alsa-driver.xml \ > tracepoint.xml drm.xml media_api.xml w1.xml \ > - writing_musb_glue_layer.xml crypto-API.xml > + writing_musb_glue_layer.xml crypto-API.xml thermal.xml > + writing_musb_glue_layer.xml Duplicated writing_musb_glue_layer.xml ? Looks like the second line should be removed. > > include Documentation/DocBook/media/Makefile > > diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl > new file mode 100644 > index 0000000..f8fb8a2 > --- /dev/null > +++ b/Documentation/DocBook/thermal.tmpl > @@ -0,0 +1,88 @@ > + > + + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" []> > + > + > + > + Linux Kernel Thermal Framework API > + > + > + > + Eduardo > + Valentin > + > +
> + evalenti@kernel.org > +
> + > + > + > + > + > + 2008-2014 > + Eduardo Valentin > + Sujith Thomas > + Zhang Rui > + > + > + > + This documentation is free software; you can redistribute > + it and/or modify it under the terms of the GNU General Public > + License version 2 as published by the Free Software Foundation. > + > + > + > + This program is distributed in the hope that it will be > + useful, but WITHOUT ANY WARRANTY; without even the implied > + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. > + See the GNU General Public License for more details. > + > + > + > + For more details see the file COPYING in the source > + distribution of Linux. > + > + > + > + > + > + > + > + Introduction > + Thermal management is any method or technique implied to > + mitigate emergencies caused by operating devices within > + unsupported temperatures. The challenge consists of designing a > + product keeping the junction temperature of the IC components. > + The operating temperature of IC components used on products must > + operate within their design limits. Besides, temperature towards > + device enclosure must be in a comfort level for the user. > + Therefore, thermal management, by the time of this writing, > + starts in very early device design phase. Managing thermal may > + involve different disciplines, at different stages, such as > + temperature monitoring, floorplanning, microarchitectural > + techniques, compiler techniques, OS techniques, liquid cooling, > + and thermal reliability or security. This document covers what > + the Linux Kernel Thermal Framework provides as abstraction to > + users with respect to thermal management. > + > + One of the first proposals to provide a solution to cover > + the thermal problem appears in the Advanced Configuration and > + Power Interface (ACPI) specification. ACPI provides an open > + standard for device configuration and power management by the > + operating system. However, several computing devices which may > + have thermal issues in the market disregard the ACPI standard. > + Therefore, the Linux Kernel Thermal Framework has been designed > + to serve as abstraction for ACPI and non-ACPI systems. The core > + concepts applies in both types of systems. > + > + The Linux Kernel Thermal Framework has a design which > + represents the different thermal constraints found in an > + end-products. The thermal constraints exist to serve different > + purposes. There two major types of thermal constraints. The are > + first is related to components junction temperature. The second > + is related to the level of comfort while end users are handling > + devices. > + > + > + > + Cheers, Javi -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/