Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753265AbbBYSao (ORCPT ); Wed, 25 Feb 2015 13:30:44 -0500 Received: from mail-pa0-f45.google.com ([209.85.220.45]:35478 "EHLO mail-pa0-f45.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1752739AbbBYSam (ORCPT ); Wed, 25 Feb 2015 13:30:42 -0500 Date: Wed, 25 Feb 2015 14:30:37 -0400 From: Eduardo Valentin To: Lukasz Majewski Cc: Kamil Debski , Jean Delvare , Guenter Roeck , Kukjin Kim , lm-sensors@lm-sensors.org, Linux PM list , "linux-samsung-soc@vger.kernel.org" , devicetree@vger.kernel.org, Lukasz Majewski , Kukjin Kim , linux-kernel@vger.kernel.org, Sjoerd Simons , Abhilash Kesavan , Abhilash Kesavan Subject: Re: [PATCH v4 5/8] ARM: dts: Add properties to use pwm-fan device as a cooling device in Odroid U3 Message-ID: <20150225183035.GC2306@developer.amazonguestwifi.org> References: <1418897591-18332-1-git-send-email-l.majewski@samsung.com> <1424254056-5904-1-git-send-email-l.majewski@samsung.com> <1424254056-5904-6-git-send-email-l.majewski@samsung.com> <20150224193711.GA353@developer.amazonguestwifi.org> <20150225142815.562fe22b@amdc2363> MIME-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha1; protocol="application/pgp-signature"; boundary="1ccMZA6j1vT5UqiK" Content-Disposition: inline In-Reply-To: <20150225142815.562fe22b@amdc2363> User-Agent: Mutt/1.5.22 (2013-10-16) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 3755 Lines: 134 --1ccMZA6j1vT5UqiK Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Content-Transfer-Encoding: quoted-printable On Wed, Feb 25, 2015 at 02:28:15PM +0100, Lukasz Majewski wrote: > Hi Eduardo, >=20 > > On Wed, Feb 18, 2015 at 11:07:33AM +0100, Lukasz Majewski wrote: > > > With those bindings it is possible to use pwm-fan device available > > > in Odroid U3 as a cooling device. > > >=20 > > > Signed-off-by: Lukasz Majewski > > > --- > > > Changes for v2: > > > - Rename cooling-pwm-values property to cooling-levels > > > Changes for v3: > > > - Change patch's topic to "ARM dts" > > > - Reduce maximal cooling-level to 230 from 255 > > > Changes for v4: > > > - None > > > --- > > > arch/arm/boot/dts/exynos4412-odroidu3.dts | 33 > > > ++++++++++++++++++++++++++++++- 1 file changed, 32 insertions(+), 1 > > > deletion(-) > > >=20 > > > diff --git a/arch/arm/boot/dts/exynos4412-odroidu3.dts > > > b/arch/arm/boot/dts/exynos4412-odroidu3.dts index 60bd1e4..3e5df3e > > > 100644 --- a/arch/arm/boot/dts/exynos4412-odroidu3.dts > > > +++ b/arch/arm/boot/dts/exynos4412-odroidu3.dts > > > @@ -32,11 +32,42 @@ > > > }; > > > }; > > > =20 > > > - pwm-fan { > > > + fan0: pwm-fan { > > > compatible =3D "pwm-fan"; > > > pwms =3D <&pwm 0 10000 0>; > > > + cooling-min-state =3D <0>; > > > + cooling-max-state =3D <3>; > > > + #cooling-cells =3D <2>; > > > + cooling-levels =3D <0 102 170 230>; > > > status =3D "okay"; > > > }; > > > + > > > + thermal-zones { > > > + cpu_thermal: cpu-thermal { > >=20 > >=20 > > This thermal zone misses the mandatory properties as per=20 > > Documentation/devicetree/bindings/thermal/thermal.txt >=20 > Following mandatory properties: > thermal-sensors =3D <&tmu 0>; > polling-delay-passive =3D <0>; > polling-delay =3D <0>; > trips { >=20 > } >=20 > are defined in exynos4-cpu-thermal.dtsi included by this file. >=20 > In this patch only device dependent changes are stated. OK. I missed that. >=20 > >=20 > > > + cooling-maps { > > > + map0 { > > > + trip =3D <&cpu_alert1>; > > > + cooling-device =3D <&cpu0 7 7>; > > > + }; > > > + map1 { > > > + trip =3D <&cpu_alert2>; > > > + cooling-device =3D <&cpu0 13 > > > 13>; > > > + }; > > > + map2 { > > > + trip =3D <&cpu_alert0>; > > > + cooling-device =3D <&fan0 0 1>; > > > + }; > > > + map3 { > > > + trip =3D <&cpu_alert1>; > > > + cooling-device =3D <&fan0 1 2>; > > > + }; > > > + map4 { > > > + trip =3D <&cpu_alert2>; > > > + cooling-device =3D <&fan0 2 3>; > > > + }; > > > + }; > > > + }; > > > + }; > > > }; > > > =20 > > > &pwm { > > > --=20 > > > 2.0.0.rc2 > > >=20 >=20 >=20 >=20 > --=20 > Best regards, >=20 > Lukasz Majewski >=20 > Samsung R&D Institute Poland (SRPOL) | Linux Platform Group --1ccMZA6j1vT5UqiK Content-Type: application/pgp-signature; name="signature.asc" Content-Description: Digital signature -----BEGIN PGP SIGNATURE----- Version: GnuPG v2 iQEcBAEBAgAGBQJU7hTDAAoJEMLUO4d9pOJW3UgIAJuPitfzUpvx64fKWhzkwJEo Wqurf/24cFmq4hfTc2XzZWD4m+UgGbKEVlk/4Nh0Sf5HTOgYB5xuXjex1UnwFH4q vJ04nR/UXHL3utrVOgoHrRKfpzRRqr3NE1XjbgBzv/KQkX5coVfPGZHGn1QEdKoI GUYU8NxGpAGgnTFDVX4PmrPtj8XEHLdbtr59yaYG1ATH+C/guGZZqPE8xd2RN80H 5ikrFzoX8azLo/o/7l89KeWrASavVTbnwY/zAPqOcULMpnfjwov6yJmDf9jhcFhT SDq6HYdkQIcZWql6/a/zqtWCT4deAq8dqlOlFYZNoHvgWOmkaYROrS1tGB9pCJ0= =EDyM -----END PGP SIGNATURE----- --1ccMZA6j1vT5UqiK-- -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/