Date: Wed, 4 Nov 2015 11:36:46 -0800
From: Eduardo Valentin <edubezval@gmail.com>
To: Punit Agrawal <punit.agrawal@arm.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>,
        Dawei Chien <dawei.chien@mediatek.com>,
        "Rafael J. Wysocki" <rjw@rjwysocki.net>,
        Rob Herring <robh+dt@kernel.org>, Pawel Moll <pawel.moll@arm.com>,
        Mark Rutland <mark.rutland@arm.com>,
        Ian Campbell <ijc+devicetree@hellion.org.uk>,
        Kumar Gala <galak@codeaurora.org>,
        Matthias Brugger <matthias.bgg@gmail.com>,
        Daniel Kurtz <djkurtz@chromium.org>,
        Sascha Hauer <s.hauer@pengutronix.de>,
        Daniel Lezcano <daniel.lezcano@linaro.org>, devicetree@vger.kernel.org,
        linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org,
        linux-pm@vger.kernel.org, linux-mediatek@lists.infradead.org,
        srv_heupstream@mediatek.com, Sascha Hauer <kernel@pengutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model
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 <20151028154449.GH3716@ubuntu>
 <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com>
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On Mon, Nov 02, 2015 at 03:53:33PM +0000, Punit Agrawal wrote:
> Viresh Kumar <viresh.kumar@linaro.org> writes:
> 
> > On 22-10-15, 20:02, Dawei Chien wrote:
> >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
> >> The power allocator governor allocates power budget to control CPU temperature.
> >> 
> >> Power Allocator governor is able to keep SOC temperature within a
> >> defined temperature range to avoid SOC overheat and keep it's
> >> performance. mt8173-cpufreq.c need to register its' own power model
> >> with power allocator thermal governor, so that power allocator
> >> governor can allocates suitable power budget to control CPU
> >> temperature.
> >> 
> >> PATCH1 is base on
> >> https://patchwork.kernel.org/patch/7034601/
> >> 
> >> PATCH2 is base on Sascha's thermal driver V9
> >> https://patchwork.kernel.org/patch/7249821/
> >> https://patchwork.kernel.org/patch/7249861/
> >> https://patchwork.kernel.org/patch/7249891/
> >> 
> >> Change since V1:
> >> include mt8171.h and sort header file for mt8173.dtsi
> >> 
> >> Change since V2:
> >> Move dynamic/static power model in device tree
> >> 
> >> Dawei.Chien (2):
> >>   thermal: mediatek: Add cpu power cooling model.
> >>   arm64: dts: mt8173: Add thermal zone node for mt8173.
> >
> > Sorry for being extremely late in reviewing this stuff. You are
> > already on v3 and I haven't reviewed it once. Mostly due to bad timing
> > of my holidays and other work pressure.
> >
> > Now, there are few things that I feel are not properly addressed here,
> > and I may be wrong:
> > - Where are the bindings for static-power-points and
> >   dynamic-power-coefficient. Sorry I failed to see them in this or
> >   other series you mentioned.
> 
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
> 
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html

Are you sure this binding is applicable only to ARM cpus?

> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
> 
> > - Even then, why should we be adding another table into DT for
> >   voltage/power ? And not reuse and extend the opp-v2 stuff which is
> >   already mainlined now.
> > - There are few issues with the code as well, but I want to see where
> >   the bindings should go first. And then only discuss the code
> >   further.
> --
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