Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S965407AbdCXKTS (ORCPT ); Fri, 24 Mar 2017 06:19:18 -0400 Received: from mail-pg0-f65.google.com ([74.125.83.65]:32964 "EHLO mail-pg0-f65.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1754844AbdCXKTC (ORCPT ); Fri, 24 Mar 2017 06:19:02 -0400 Subject: Re: [PATCH v6 03/11] dt-bindings: perf: hisi: Add Devicetree bindings for Hisilicon SoC PMU To: Mark Rutland References: <1489127248-112605-1-git-send-email-anurup.m@huawei.com> <20170321140741.GD22188@leverpostej> <20170321172819.GE29116@leverpostej> Cc: dikshit.n@huawei.com, devicetree@vger.kernel.org, wangkefeng.wang@huawei.com, sanil.kumar@hisilicon.com, gabriele.paoloni@huawei.com, huangdaode@hisilicon.com, tanxiaojun@huawei.com, john.garry@huawei.com, will.deacon@arm.com, linux-kernel@vger.kernel.org, xuwei5@hisilicon.com, linuxarm@huawei.com, zhangshaokun@hisilicon.com, robh+dt@kernel.org, anurup.m@huawei.com, shyju.pv@huawei.com, linux-arm-kernel@lists.infradead.org, shiju.jose@huawei.com From: Anurup M Message-ID: <58D4F28F.8080403@gmail.com> Date: Fri, 24 Mar 2017 15:48:55 +0530 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:38.0) Gecko/20100101 Thunderbird/38.5.1 MIME-Version: 1.0 In-Reply-To: <20170321172819.GE29116@leverpostej> Content-Type: text/plain; charset=windows-1252; format=flowed Content-Transfer-Encoding: 7bit Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 1994 Lines: 48 On Tuesday 21 March 2017 10:58 PM, Mark Rutland wrote: > On Tue, Mar 21, 2017 at 02:07:42PM +0000, Mark Rutland wrote: >> On Fri, Mar 10, 2017 at 01:27:27AM -0500, Anurup M wrote: >>> +HiSilicon SoC chip is encapsulated by multiple CPU and IO dies. The CPU die >>> +is called as Super CPU cluster (SCCL) which includes 16 cpu-cores. Every SCCL >>> +in HiP05/06/07 chips are further grouped as CPU clusters (CCL) which includes >>> +4 cpu-cores each. >>> +e.g. In the case of HiP05/06/07, each SCCL has 1 L3 cache and 1 MN PMU device. >>> +The L3 cache is further grouped as 4 L3 cache banks in a SCCL. >>> + >>> +The Hisilicon SoC PMU DT node bindings for uncore PMU devices are as below. >>> +For PMU devices like L3 cache. MN etc. which are accessed using the djtag, >>> +the parent node will be the djtag node of the corresponding CPU die (SCCL). >>> + >>> +L3 cache >>> +--------- >>> +The L3 cache is dedicated for each SCCL. Each SCCL in HiP05/06/07 chips have 4 >>> +L3 cache banks. Each L3 cache bank have separate DT nodes. >>> + >>> +Required properties: >>> + >>> + - compatible : This value should be as follows >>> + (a) "hisilicon,hip05-pmu-l3c-v1" for v1 hw in HiP05 chipset >>> + (b) "hisilicon,hip06-pmu-l3c-v1" for v1 hw in HiP06 chipset >>> + (c) "hisilicon,hip07-pmu-l3c-v2" for v2 hw in HiP07 chipset >>> + >>> + - hisilicon,module-id : This property is a combination of two values >>> + in the below order. >>> + a) Module ID: The module identifier for djtag. >>> + b) Instance or Bank ID: This will identify the L3 cache bank >>> + or instance. >> I take it this is intended two mean this property is two cells in >> length, with one cell for each of the below. >> >> This is a somewhat confusing proeprty given that the name only applies >> to the first half of the value... > Please split this itno two properties, and have a hisilicon,instance-id > for the L3 nodes. Sure. Shall add hisilicon,instance-id for L3 nodes. Thanks, Anurup > Thanks, > Mark.