Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753169AbdFUCV7 (ORCPT ); Tue, 20 Jun 2017 22:21:59 -0400 Received: from szxga01-in.huawei.com ([45.249.212.187]:8769 "EHLO szxga01-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753006AbdFUCV6 (ORCPT ); Tue, 20 Jun 2017 22:21:58 -0400 Subject: Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660 To: Wei Xu , , , , , , CC: , , , , , References: <1497930035-60894-1-git-send-email-kevin.wangtao@hisilicon.com> <1497930035-60894-2-git-send-email-kevin.wangtao@hisilicon.com> <5948F983.5060902@hisilicon.com> From: "Wangtao (Kevin, Kirin)" Message-ID: Date: Wed, 21 Jun 2017 10:21:11 +0800 User-Agent: Mozilla/5.0 (Windows NT 6.1; WOW64; rv:52.0) Gecko/20100101 Thunderbird/52.2.0 MIME-Version: 1.0 In-Reply-To: <5948F983.5060902@hisilicon.com> Content-Type: text/plain; charset="UTF-8"; format=flowed Content-Transfer-Encoding: 7bit X-Originating-IP: [10.121.88.70] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A020202.5949D83A.0047,ss=1,re=0.000,recu=0.000,reip=0.000,cl=1,cld=1,fgs=0, ip=0.0.0.0, so=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: 07357f49f672ac876d423437ebd4214f Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 8178 Lines: 271 e( 2017/6/20 18:31, Wei Xu ei: > Hi Tao Wang, > > On 2017/6/20 4:40, Tao Wang wrote: >> This patch adds the support for thermal sensor of Hi3660 SoC. >> this will register sensors for thermal framework and use device >> tree to bind cooling device. >> >> Signed-off-by: Tao Wang >> Signed-off-by: Leo Yan >> --- >> drivers/thermal/Kconfig | 10 ++ >> drivers/thermal/Makefile | 1 + >> drivers/thermal/hi3660_thermal.c | 198 ++++++++++++++++++++++++++++++++++++++ >> 3 files changed, 209 insertions(+) >> create mode 100644 drivers/thermal/hi3660_thermal.c >> >> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig >> index b5b5fac..3e7fa95 100644 >> --- a/drivers/thermal/Kconfig >> +++ b/drivers/thermal/Kconfig >> @@ -203,6 +203,16 @@ config HISI_THERMAL >> thermal framework. cpufreq is used as the cooling device to throttle >> CPUs when the passive trip is crossed. >> >> +config HI3660_THERMAL > > Please keep alphabet order and swap the order > between HI3660_THERMAL and HISI_THERMAL. OK > > Thanks! > > BR, > Wei > >> + tristate "Hi3660 thermal driver" >> + depends on ARCH_HISI || COMPILE_TEST >> + depends on HAS_IOMEM >> + depends on OF >> + default y >> + help >> + Enable this to plug Hi3660 thermal driver into the Linux thermal >> + framework. >> + >> config IMX_THERMAL >> tristate "Temperature sensor driver for Freescale i.MX SoCs" >> depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST >> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile >> index 094d703..f29d0a5 100644 >> --- a/drivers/thermal/Makefile >> +++ b/drivers/thermal/Makefile >> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o >> obj-$(CONFIG_ST_THERMAL) += st/ >> obj-$(CONFIG_QCOM_TSENS) += qcom/ >> obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ >> +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o >> obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o >> obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o >> obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o >> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c >> new file mode 100644 >> index 0000000..a538721 >> --- /dev/null >> +++ b/drivers/thermal/hi3660_thermal.c >> @@ -0,0 +1,198 @@ >> +/* >> + * linux/drivers/thermal/hi3660_thermal.c >> + * >> + * Copyright (c) 2017 Hisilicon Limited. >> + * Copyright (c) 2017 Linaro Limited. >> + * >> + * Author: Tao Wang >> + * Author: Leo Yan >> + * >> + * This program is free software; you can redistribute it and/or modify >> + * it under the terms of the GNU General Public License as published by >> + * the Free Software Foundation; version 2 of the License. >> + * >> + * This program is distributed in the hope that it will be useful, >> + * but WITHOUT ANY WARRANTY; without even the implied warranty of >> + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the >> + * GNU General Public License for more details. >> + * >> + * You should have received a copy of the GNU General Public License >> + * along with this program. If not, see . >> + */ >> + >> +#include >> +#include >> +#include >> +#include >> +#include >> +#include >> +#include >> +#include >> +#include >> + >> +#include "thermal_core.h" >> + >> +#define HW_MAX_SENSORS 4 >> +#define HISI_MAX_SENSORS 6 >> +#define SENSOR_MAX 4 >> +#define SENSOR_AVG 5 >> + >> +#define ADC_MIN 116 >> +#define ADC_MAX 922 >> + >> +/* hi3660 Thermal Sensor Dev Structure */ >> +struct hi3660_thermal_sensor { >> + struct hi3660_thermal_data *thermal; >> + struct thermal_zone_device *tzd; >> + >> + uint32_t id; >> +}; >> + >> +struct hi3660_thermal_data { >> + struct platform_device *pdev; >> + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; >> + void __iomem *thermal_base; >> +}; >> + >> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc }; >> + >> + >> +static int hi3660_thermal_get_temp(void *_sensor, int *temp) >> +{ >> + struct hi3660_thermal_sensor *sensor = _sensor; >> + struct hi3660_thermal_data *data = sensor->thermal; >> + unsigned int idx; >> + int val, average = 0, max = 0; >> + >> + if (sensor->id < HW_MAX_SENSORS) { >> + val = readl(data->thermal_base + sensor_reg_offset[sensor->id]); >> + val = clamp_val(val, ADC_MIN, ADC_MAX); >> + } else { >> + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { >> + val = readl(data->thermal_base >> + + sensor_reg_offset[idx]); >> + val = clamp_val(val, ADC_MIN, ADC_MAX); >> + average += val; >> + if (val > max) >> + max = val; >> + } >> + >> + if (sensor->id == SENSOR_MAX) >> + val = max; >> + else if (sensor->id == SENSOR_AVG) >> + val = average / HW_MAX_SENSORS; >> + } >> + >> + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000; >> + >> + return 0; >> +} >> + >> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { >> + .get_temp = hi3660_thermal_get_temp, >> +}; >> + >> +static int hi3660_thermal_register_sensor(struct platform_device *pdev, >> + struct hi3660_thermal_data *data, >> + struct hi3660_thermal_sensor *sensor, >> + int index) >> +{ >> + int ret = 0; >> + >> + sensor->id = index; >> + sensor->thermal = data; >> + >> + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev, >> + sensor->id, sensor, &hi3660_of_thermal_ops); >> + if (IS_ERR(sensor->tzd)) { >> + ret = PTR_ERR(sensor->tzd); >> + sensor->tzd = NULL; >> + } >> + >> + return ret; >> +} >> + >> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor, >> + bool on) >> +{ >> + struct thermal_zone_device *tzd = sensor->tzd; >> + >> + tzd->ops->set_mode(tzd, >> + on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED); >> +} >> + >> +static int hi3660_thermal_probe(struct platform_device *pdev) >> +{ >> + struct device *dev = &pdev->dev; >> + struct hi3660_thermal_data *data; >> + struct resource *res; >> + int ret = 0; >> + int i; >> + >> + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); >> + if (!data) >> + return -ENOMEM; >> + >> + data->pdev = pdev; >> + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); >> + data->thermal_base = devm_ioremap_resource(dev, res); >> + if (IS_ERR(data->thermal_base)) { >> + dev_err(dev, "failed get reg base\n"); >> + return -ENOMEM; >> + } >> + >> + platform_set_drvdata(pdev, data); >> + >> + for (i = 0; i < HISI_MAX_SENSORS; ++i) { >> + ret = hi3660_thermal_register_sensor(pdev, data, >> + &data->sensors[i], i); >> + if (ret) >> + dev_err(&pdev->dev, >> + "failed to register thermal sensor%d: %d\n", >> + i, ret); >> + else >> + hi3660_thermal_toggle_sensor(&data->sensors[i], true); >> + } >> + >> + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); >> + return 0; >> +} >> + >> +static int hi3660_thermal_exit(struct platform_device *pdev) >> +{ >> + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); >> + int i; >> + >> + for (i = 0; i < HISI_MAX_SENSORS; i++) { >> + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; >> + >> + if (!sensor->tzd) >> + continue; >> + >> + hi3660_thermal_toggle_sensor(sensor, false); >> + } >> + >> + return 0; >> +} >> + >> +static const struct of_device_id hi3660_thermal_id_table[] = { >> + { .compatible = "hisilicon,thermal-hi3660" }, >> + {} >> +}; >> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); >> + >> +static struct platform_driver hi3660_thermal_driver = { >> + .probe = hi3660_thermal_probe, >> + .remove = hi3660_thermal_exit, >> + .driver = { >> + .name = "hi3660_thermal", >> + .of_match_table = hi3660_thermal_id_table, >> + }, >> +}; >> + >> +module_platform_driver(hi3660_thermal_driver); >> + >> +MODULE_AUTHOR("Tao Wang "); >> +MODULE_AUTHOR("Leo Yan "); >> +MODULE_DESCRIPTION("hi3660 thermal driver"); >> +MODULE_LICENSE("GPL v2"); >> > > > . >