Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753140AbdFUCaE (ORCPT ); Tue, 20 Jun 2017 22:30:04 -0400 Received: from mail-pf0-f175.google.com ([209.85.192.175]:33037 "EHLO mail-pf0-f175.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753055AbdFUCaD (ORCPT ); Tue, 20 Jun 2017 22:30:03 -0400 Date: Wed, 21 Jun 2017 10:29:54 +0800 From: Leo Yan To: Tao Wang Cc: rui.zhang@intel.com, edubezval@gmail.com, robh+dt@kernel.org, mark.rutland@arm.com, xuwei5@hisilicon.com, catalin.marinas@arm.com, will.deacon@arm.com, linux-pm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-arm-kernel@lists.infradead.org, sunzhaosheng@hisilicon.com Subject: Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660 Message-ID: <20170621022954.GA12065@leoy-ThinkPad-T440> References: <1497930035-60894-1-git-send-email-kevin.wangtao@hisilicon.com> <1497930035-60894-2-git-send-email-kevin.wangtao@hisilicon.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <1497930035-60894-2-git-send-email-kevin.wangtao@hisilicon.com> User-Agent: Mutt/1.5.21 (2010-09-15) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 6263 Lines: 222 Hi Rui, Eduardo, On Tue, Jun 20, 2017 at 11:40:34AM +0800, Tao Wang wrote: [...] > diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c > new file mode 100644 > index 0000000..a538721 > --- /dev/null > +++ b/drivers/thermal/hi3660_thermal.c > @@ -0,0 +1,198 @@ > +/* > + * linux/drivers/thermal/hi3660_thermal.c > + * > + * Copyright (c) 2017 Hisilicon Limited. > + * Copyright (c) 2017 Linaro Limited. > + * > + * Author: Tao Wang > + * Author: Leo Yan > + * > + * This program is free software; you can redistribute it and/or modify > + * it under the terms of the GNU General Public License as published by > + * the Free Software Foundation; version 2 of the License. > + * > + * This program is distributed in the hope that it will be useful, > + * but WITHOUT ANY WARRANTY; without even the implied warranty of > + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the > + * GNU General Public License for more details. > + * > + * You should have received a copy of the GNU General Public License > + * along with this program. If not, see . > + */ > + > +#include > +#include > +#include > +#include > +#include > +#include > +#include > +#include > +#include > + > +#include "thermal_core.h" > + > +#define HW_MAX_SENSORS 4 > +#define HISI_MAX_SENSORS 6 > +#define SENSOR_MAX 4 > +#define SENSOR_AVG 5 > + > +#define ADC_MIN 116 > +#define ADC_MAX 922 > + > +/* hi3660 Thermal Sensor Dev Structure */ > +struct hi3660_thermal_sensor { > + struct hi3660_thermal_data *thermal; > + struct thermal_zone_device *tzd; > + > + uint32_t id; > +}; > + > +struct hi3660_thermal_data { > + struct platform_device *pdev; > + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; > + void __iomem *thermal_base; > +}; > + > +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc }; > + > + > +static int hi3660_thermal_get_temp(void *_sensor, int *temp) > +{ > + struct hi3660_thermal_sensor *sensor = _sensor; > + struct hi3660_thermal_data *data = sensor->thermal; > + unsigned int idx; > + int val, average = 0, max = 0; > + > + if (sensor->id < HW_MAX_SENSORS) { > + val = readl(data->thermal_base + sensor_reg_offset[sensor->id]); > + val = clamp_val(val, ADC_MIN, ADC_MAX); > + } else { > + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { > + val = readl(data->thermal_base > + + sensor_reg_offset[idx]); > + val = clamp_val(val, ADC_MIN, ADC_MAX); > + average += val; > + if (val > max) > + max = val; > + } > + > + if (sensor->id == SENSOR_MAX) > + val = max; > + else if (sensor->id == SENSOR_AVG) > + val = average / HW_MAX_SENSORS; > + } I think here have one thing it's better to check with you ahead and want your suggestions. Tao adds two 'software' sensors, one is sensor 4 which is used to present the maximum temperature value crossing from sensor 0 ~ 3; and another sensor 4 is used to present the average temperature value. Does this make sense for you? > + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000; > + > + return 0; > +} > + > +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { > + .get_temp = hi3660_thermal_get_temp, > +}; > + > +static int hi3660_thermal_register_sensor(struct platform_device *pdev, > + struct hi3660_thermal_data *data, > + struct hi3660_thermal_sensor *sensor, > + int index) > +{ > + int ret = 0; > + > + sensor->id = index; > + sensor->thermal = data; > + > + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev, > + sensor->id, sensor, &hi3660_of_thermal_ops); > + if (IS_ERR(sensor->tzd)) { > + ret = PTR_ERR(sensor->tzd); > + sensor->tzd = NULL; > + } > + > + return ret; > +} > + > +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor, > + bool on) > +{ > + struct thermal_zone_device *tzd = sensor->tzd; > + > + tzd->ops->set_mode(tzd, > + on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED); > +} > + > +static int hi3660_thermal_probe(struct platform_device *pdev) > +{ > + struct device *dev = &pdev->dev; > + struct hi3660_thermal_data *data; > + struct resource *res; > + int ret = 0; > + int i; > + > + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); > + if (!data) > + return -ENOMEM; > + > + data->pdev = pdev; > + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); > + data->thermal_base = devm_ioremap_resource(dev, res); > + if (IS_ERR(data->thermal_base)) { > + dev_err(dev, "failed get reg base\n"); > + return -ENOMEM; > + } > + > + platform_set_drvdata(pdev, data); > + > + for (i = 0; i < HISI_MAX_SENSORS; ++i) { > + ret = hi3660_thermal_register_sensor(pdev, data, > + &data->sensors[i], i); > + if (ret) > + dev_err(&pdev->dev, > + "failed to register thermal sensor%d: %d\n", > + i, ret); > + else > + hi3660_thermal_toggle_sensor(&data->sensors[i], true); > + } > + > + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); > + return 0; > +} > + > +static int hi3660_thermal_exit(struct platform_device *pdev) > +{ > + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); > + int i; > + > + for (i = 0; i < HISI_MAX_SENSORS; i++) { > + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; > + > + if (!sensor->tzd) > + continue; > + > + hi3660_thermal_toggle_sensor(sensor, false); > + } > + > + return 0; > +} > + > +static const struct of_device_id hi3660_thermal_id_table[] = { > + { .compatible = "hisilicon,thermal-hi3660" }, > + {} > +}; > +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); > + > +static struct platform_driver hi3660_thermal_driver = { > + .probe = hi3660_thermal_probe, > + .remove = hi3660_thermal_exit, > + .driver = { > + .name = "hi3660_thermal", > + .of_match_table = hi3660_thermal_id_table, > + }, > +}; > + > +module_platform_driver(hi3660_thermal_driver); > + > +MODULE_AUTHOR("Tao Wang "); > +MODULE_AUTHOR("Leo Yan "); > +MODULE_DESCRIPTION("hi3660 thermal driver"); > +MODULE_LICENSE("GPL v2"); > -- > 1.7.9.5 >