Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1752655AbdHKG2I (ORCPT ); Fri, 11 Aug 2017 02:28:08 -0400 Received: from gloria.sntech.de ([95.129.55.99]:46308 "EHLO gloria.sntech.de" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1750909AbdHKG2G (ORCPT ); Fri, 11 Aug 2017 02:28:06 -0400 From: Heiko Stuebner To: Zhang Rui Cc: Rocky Hao , edubezval@gmail.com, robh+dt@kernel.org, mark.rutland@arm.com, catalin.marinas@arm.com, will.deacon@arm.com, shawn.lin@rock-chips.com, cl@rock-chips.com, william.wu@rock-chips.com, linux-pm@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-rockchip@lists.infradead.org, linux-kernel@vger.kernel.org, devicetree@vger.kernel.org, xxx@rock-chips.com, jay.xu@rock-chips.com, wxt@rock-chips.com, huangtao@rock-chips.com Subject: Re: [PATCH v2 0/5] thermal: rockchip: add tsadc support in thermal driver and IPA thermal control for rk3328 in dts Date: Fri, 11 Aug 2017 08:27:43 +0200 Message-ID: <3025917.NAhhjSz36M@phil> User-Agent: KMail/5.2.3 (Linux/4.9.0-2-amd64; KDE/5.28.0; x86_64; ; ) In-Reply-To: <1502427095.2598.21.camel@intel.com> References: <1501833976-1100-1-git-send-email-rocky.hao@rock-chips.com> <1502427095.2598.21.camel@intel.com> MIME-Version: 1.0 Content-Transfer-Encoding: 7Bit Content-Type: text/plain; charset="us-ascii" Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 1213 Lines: 33 Hi, Am Freitag, 11. August 2017, 12:51:35 CEST schrieb Zhang Rui: > On Fri, 2017-08-04 at 16:06 +0800, Rocky Hao wrote: > > This series patches add the tsadc support in thermal driver and in > > devicetree for rk3328. > > Also add thermal control with Intelligent Power Allocation (IPA) > > policy by default. Please > > refer to https://developer.arm.com/open-source/intelligent-power-allo > > cation for more information > > about IPA. > > > > Rocky Hao (5): > > dt-bindings: rockchip-thermal: Support the RK3328 SoC compatible > > thermal: rockchip: Support the RK3328 SOC in thermal driver > > arm64: dts: rockchip: add tsadc node for rk3328 SoC > > arm64: dts: rockchip: add thermal nodes for rk3328 SoC > > arm64: dts: rockchip: Enable tsadc module on RK3328 eavluation > > board > > > I can take this patch set if we have ACK for patch 3, 4 and 5. I would prefer if you would just apply patches 1+2 alone and I'd take the devicetree patches through my tree. Having devicetree stuff mingle in a lot of trees produces unnecessary conflicts, so the general best practice is having code + binding.txt going through the driver tree and devicetree stuff through the platform tree. Thanks Heiko