Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751493AbdH2IYQ (ORCPT ); Tue, 29 Aug 2017 04:24:16 -0400 Received: from szxga04-in.huawei.com ([45.249.212.190]:5483 "EHLO szxga04-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751295AbdH2IYH (ORCPT ); Tue, 29 Aug 2017 04:24:07 -0400 From: Tao Wang To: , , , , , , CC: , , , , , , , Subject: [PATCH v4 3/3] arm64: dts: register Hi3660's thermal sensor Date: Tue, 29 Aug 2017 16:17:46 +0800 Message-ID: <1503994666-13954-4-git-send-email-kevin.wangtao@hisilicon.com> X-Mailer: git-send-email 2.8.1 In-Reply-To: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> References: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> MIME-Version: 1.0 Content-Type: text/plain X-Originating-IP: [10.177.161.152] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A090201.59A524A4.0078,ss=1,re=0.000,recu=0.000,reip=0.000,cl=1,cld=1,fgs=0, ip=0.0.0.0, so=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: 83ca64707c145ce5072af9384a504cbe Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2554 Lines: 82 From: Tao Wang Bind thermal sensor driver for Hi3660. Signed-off-by: Tao Wang Signed-off-by: Leo Yan --- arch/arm64/boot/dts/hisilicon/hi3660.dtsi | 14 +++++++++++++ include/dt-bindings/thermal/hi3660-thermal.h | 31 ++++++++++++++++++++++++++++ 2 files changed, 45 insertions(+) create mode 100644 include/dt-bindings/thermal/hi3660-thermal.h diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi index c6a1961..1ee6084 100644 --- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi +++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi @@ -6,6 +6,7 @@ #include #include +#include / { compatible = "hisilicon,hi3660"; @@ -848,5 +849,18 @@ &sdio_cfg_func>; status = "disabled"; }; + + tsensor: tsensor@fff30000 { + compatible = "hisilicon,hi3660-tsensor"; + #address-cells = <2>; + #size-cells = <2>; + reg = <0x0 0xfff3001c 0x0 0x4>, + <0x0 0xfff3005c 0x0 0x4>, + <0x0 0xfff3009c 0x0 0x4>; + hisi,tsensors = ; + hisi,coef = <165000 (-40000)>; + hisi,adc-range = <0x74 0x39A>; + #thermal-sensor-cells = <1>; + }; }; }; diff --git a/include/dt-bindings/thermal/hi3660-thermal.h b/include/dt-bindings/thermal/hi3660-thermal.h new file mode 100644 index 0000000..d9d9b6a --- /dev/null +++ b/include/dt-bindings/thermal/hi3660-thermal.h @@ -0,0 +1,31 @@ +/* + * Copyright (c) 2017 Hisilicon Limited. + * Copyright (c) 2017 Linaro Limited. + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; version 2 of the License. + * + * This program is distributed in the hope that it will be useful, + * but WITHOUT ANY WARRANTY; without even the implied warranty of + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the + * GNU General Public License for more details. + * + * You should have received a copy of the GNU General Public License + * along with this program. If not, see . + */ + +#ifndef __DTS_HI3660_THERMAL_H +#define __DTS_HI3660_THERMAL_H + +/* sensor id */ +#define LITTLE_CPU_TEMP 0 +#define BIG_CPU_TEMP 1 +#define GPU_TEMP 2 +#define MAX_TEMP 3 +#define AVG_TEMP 4 + +#define HISI_MAX_TSENSORS 3 +#define THERMAL_NO_LIMIT (~0) + +#endif -- 2.8.1