Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751382AbdHaSYa (ORCPT ); Thu, 31 Aug 2017 14:24:30 -0400 Received: from mail-wm0-f44.google.com ([74.125.82.44]:37193 "EHLO mail-wm0-f44.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1750895AbdHaSY2 (ORCPT ); Thu, 31 Aug 2017 14:24:28 -0400 X-Google-Smtp-Source: ADKCNb5rbNp3n4Eqmt+2csqtM6y3tci2IDbY60gGwBcrhFA3ojPJF4WtvUGhxAKOOxDFyR/ZFo0s+A== Subject: Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings To: Tao Wang , rui.zhang@intel.com, edubezval@gmail.com, robh+dt@kernel.org, mark.rutland@arm.com, xuwei5@hisilicon.com, catalin.marinas@arm.com, will.deacon@arm.com Cc: leo.yan@linaro.org, kevin.wangtao@linaro.org, linux-pm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-arm-kernel@lists.infradead.org, sunzhaosheng@hisilicon.com, gengyanping@hisilicon.com References: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> <1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com> From: Daniel Lezcano Message-ID: Date: Thu, 31 Aug 2017 20:24:23 +0200 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:52.0) Gecko/20100101 Thunderbird/52.2.1 MIME-Version: 1.0 In-Reply-To: <1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com> Content-Type: text/plain; charset=utf-8 Content-Language: en-US Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2773 Lines: 77 On 29/08/2017 10:17, Tao Wang wrote: > From: Tao Wang > > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Tao Wang > --- > .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ > 1 file changed, 37 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt > new file mode 100644 > index 0000000..4643dbe > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt > @@ -0,0 +1,37 @@ > +* Temperature Sensor on hisilicon SoC > + > +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D > +area contains a temperture sensor. The temperture sensor produces an output > +value which has a linear relationship with the temperture of the area. > + s/temperture/temperature/ > +for Hi3660, > +sensor0 monitors the temperture of A53; > +sensor1 monitors the temperture of A72; > +sensor2 monitors the temperture of GPU; > +sensor3 is a virtual sensor, which produces the maximum value of all sensors; > +sensor4 is a virtual sensor, which produces the average value of all sensors. I don't think we need to escribe the virtual sensors in the DT bindings. > +** Required properties : > +- compatible: "hisilicon,thermal-tsensor". > +- reg: physical reg address of thermal sensor and length of memory mapped > + region. > +- hisi,tsensors: number of hardware tsensors > +- hisi,coef: An array of integers (one signed cell) containing > + coefficients to turn adc value to temperture. > +- hisi,adc-range: adc value range, minimum value is followed by maximum value. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +Example : > +Hi3660: > +tsensor: tsensor@fff30000 { > + compatible = "hisilicon,hi3660-tsensor"; > + #address-cells = <2>; > + #size-cells = <2>; > + reg = <0x0 0xfff3001c 0x0 0x4>, > + <0x0 0xfff3005c 0x0 0x4>, > + <0x0 0xfff3009c 0x0 0x4>; > + hisi,tsensors = ; > + hisi,coef = <165000 (-40000)>; > + hisi,adc-range = <0x74 0x39A>; Do we really need max sensors, coef and adc range to be specified in the DT? Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the coef, adc, in the driver itself? Can't this binding be merged with the hisilicon-thermal.txt? Thanks. -- Daniel -- Linaro.org │ Open source software for ARM SoCs Follow Linaro: Facebook | Twitter | Blog