Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1753260AbdIDGjf (ORCPT ); Mon, 4 Sep 2017 02:39:35 -0400 Received: from szxga04-in.huawei.com ([45.249.212.190]:5515 "EHLO szxga04-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751666AbdIDGjd (ORCPT ); Mon, 4 Sep 2017 02:39:33 -0400 Subject: Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings To: Daniel Lezcano , , , , , , , CC: , , , , , , , References: <1503994666-13954-1-git-send-email-kevin.wangtao@hisilicon.com> <1503994666-13954-2-git-send-email-kevin.wangtao@hisilicon.com> From: "Wangtao (Kevin, Kirin)" Message-ID: <38fdf052-97be-1b54-5e7d-9dd0bc11e9b4@hisilicon.com> Date: Mon, 4 Sep 2017 14:39:04 +0800 User-Agent: Mozilla/5.0 (Windows NT 6.1; WOW64; rv:52.0) Gecko/20100101 Thunderbird/52.2.0 MIME-Version: 1.0 In-Reply-To: Content-Type: text/plain; charset="utf-8"; format=flowed Content-Transfer-Encoding: 8bit X-Originating-IP: [10.121.88.70] X-CFilter-Loop: Reflected X-Mirapoint-Virus-RAPID-Raw: score=unknown(0), refid=str=0001.0A090204.59ACF516.004C,ss=1,re=0.000,recu=0.000,reip=0.000,cl=1,cld=1,fgs=0, ip=0.0.0.0, so=2014-11-16 11:51:01, dmn=2013-03-21 17:37:32 X-Mirapoint-Loop-Id: f4054906de4a027c7f99d7125de7f393 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Content-Length: 2879 Lines: 77 在 2017/9/1 2:24, Daniel Lezcano 写道: > On 29/08/2017 10:17, Tao Wang wrote: >> From: Tao Wang >> >> This adds documentation of device tree bindings for the >> thermal sensor controller of hi3660 SoC. >> >> Signed-off-by: Tao Wang >> --- >> .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ >> 1 file changed, 37 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> >> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> new file mode 100644 >> index 0000000..4643dbe >> --- /dev/null >> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> @@ -0,0 +1,37 @@ >> +* Temperature Sensor on hisilicon SoC >> + >> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D >> +area contains a temperture sensor. The temperture sensor produces an output >> +value which has a linear relationship with the temperture of the area. >> + > > s/temperture/temperature/ THX > >> +for Hi3660, >> +sensor0 monitors the temperture of A53; >> +sensor1 monitors the temperture of A72; >> +sensor2 monitors the temperture of GPU; >> +sensor3 is a virtual sensor, which produces the maximum value of all sensors; >> +sensor4 is a virtual sensor, which produces the average value of all sensors. > > I don't think we need to escribe the virtual sensors in the DT bindings. I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough? > >> +** Required properties : >> +- compatible: "hisilicon,thermal-tsensor". >> +- reg: physical reg address of thermal sensor and length of memory mapped >> + region. >> +- hisi,tsensors: number of hardware tsensors >> +- hisi,coef: An array of integers (one signed cell) containing >> + coefficients to turn adc value to temperture. >> +- hisi,adc-range: adc value range, minimum value is followed by maximum value. >> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. >> + >> +Example : >> +Hi3660: >> +tsensor: tsensor@fff30000 { >> + compatible = "hisilicon,hi3660-tsensor"; >> + #address-cells = <2>; >> + #size-cells = <2>; >> + reg = <0x0 0xfff3001c 0x0 0x4>, >> + <0x0 0xfff3005c 0x0 0x4>, >> + <0x0 0xfff3009c 0x0 0x4>; >> + hisi,tsensors = ; >> + hisi,coef = <165000 (-40000)>; >> + hisi,adc-range = <0x74 0x39A>; > > Do we really need max sensors, coef and adc range to be specified in the DT? > > Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the > coef, adc, in the driver itself? My purpose is to make the driver be compitable with our future platform. > > Can't this binding be merged with the hisilicon-thermal.txt? > > Thanks. > > -- Daniel > >