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Date:   Mon, 29 Jan 2018 10:49:18 +0100
From:   Maxime Ripard <maxime.ripard@free-electrons.com>
To:     Philipp Rossak <embed3d@gmail.com>
Cc:     lee.jones@linaro.org, robh+dt@kernel.org, mark.rutland@arm.com,
        wens@csie.org, linux@armlinux.org.uk, jic23@kernel.org,
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        linux-sunxi@googlegroups.com
Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the
 thermal sensor in H3 and H5
Message-ID: <20180129094918.4fvxpmoftgxxkqg3@flea.lan>
References: <20180128232919.12639-1-embed3d@gmail.com>
 <20180128232919.12639-12-embed3d@gmail.com>
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Hi,

On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote:
> As we have gained the support for the thermal sensor in H3 and H5,
> we can now add its device nodes to the device tree. The H3 and H5 share
> most of its compatible. The compatible and the thermal sensor cells
> will be added in an additional patch per device.
>=20
> Signed-off-by: Philipp Rossak <embed3d@gmail.com>
> ---
>  arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++
>  1 file changed, 9 insertions(+)
>=20
> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi=
-h3-h5.dtsi
> index 7a83b15225c7..413c789b588d 100644
> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi
> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi
> @@ -426,6 +426,15 @@
>  			};
>  		};
> =20
> +		ths: thermal-sensor@1c25000 {
> +			reg =3D <0x01c25000 0x100>;

The size is 0x400

Maxime

--=20
Maxime Ripard, Free Electrons
Embedded Linux and Kernel engineering
http://free-electrons.com

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