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[216.188.254.6]) by smtp.gmail.com with ESMTPSA id m85sm3170278oik.19.2018.01.29.11.48.41 (version=TLS1_2 cipher=ECDHE-RSA-CHACHA20-POLY1305 bits=256/256); Mon, 29 Jan 2018 11:48:41 -0800 (PST) Date: Mon, 29 Jan 2018 13:48:40 -0600 From: Rob Herring To: Maxime Ripard Cc: Icenowy Zheng , linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org, linux-sunxi@googlegroups.com, Marc Zyngier , Linus Walleij , Daniel Lezcano , Russell King , linux-kernel@vger.kernel.org, linux-gpio@vger.kernel.org, Chen-Yu Tsai , linux-clk@vger.kernel.org Subject: Re: [RFC PATCH 0/9] initial support for "suniv" Allwinner new ARM9 SoC Message-ID: <20180129194840.fcwlre3wmikphg2f@rob-hp-laptop> References: <20180119231735.61504-1-icenowy@aosc.io> <20180122121435.bpayxk4uzfqbhqse@flea.lan> <14593819.uISRktVE4V@ice-x220i> <20180125153520.lxcfvh3yvi36uiux@flea.lan> MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline Content-Transfer-Encoding: 8bit In-Reply-To: <20180125153520.lxcfvh3yvi36uiux@flea.lan> User-Agent: NeoMutt/20170609 (1.8.3) Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Thu, Jan 25, 2018 at 04:35:20PM +0100, Maxime Ripard wrote: > Hi, > > On Wed, Jan 24, 2018 at 09:10:34PM +0800, Icenowy Zheng wrote: > > 在 2018年1月22日星期一 CST 下午8:14:35,Maxime Ripard 写道: > > > On Sat, Jan 20, 2018 at 07:17:26AM +0800, Icenowy Zheng wrote: > > > > This is the RFC initial patchset for the "new" Allwinner SUNIV ARM9 SoC. > > > > > > > > The same die is packaged differently, come with different co-packaged > > > > DRAM or shipped with different SDK; and then made many model names: F23, > > > > F25, F1C100A, F1C100S, F1C200S, F1C500, F1C600, R6, etc. These SoCs all > > > > share a common feature set and are packaged similarly (eLQFP128 for SoCs > > > > without co-packaged DRAM, QFN88 for with DRAM). As their's no > > > > functionality hidden on the QFN88 models (except DRAM interface not > > > > exported), it's not clever to differentiate them. So I will use suniv as > > > > common name of all these SoCs. > > > > > > Where is that suniv prefix coming from? > > > > The BSP (Melis and Linux). (e.g. "libs/suniv" directory of the Melis SDK and > > "arch/arm/boot/dts/sunivw1p1.dtsi" in the Linux SDK) > > Do you have a link to that BSP? > > > > You should really answer two questions here: > > > - Are you able to predict whether you'll find an SoC part of that > > > family in the future that derives a bit and will need a compatible > > > of its own? > > > - Are you able to predict which quirks we'll need along the way to > > > support all the SoCs you've listed there? > > > > > > If you can't answer yes to both these questions, with a 100% > > > certainty, then you'll need a SoC name in the compatible. > > > > > > Which doesn't prevent you from sharing as much as possible the DT like > > > we did between the A10s and the A13 for example. > > > > So the suniv-f1c100s.dtsi will still be kept empty and all peripherals known > > should go through suniv.dtsi. > > Sorry if I wasn't really clear. You can totally keep the current DT > structure if that makes sense (and judging by what you're saying, it > does.), but the compatibles should have the SoC name in it. In case it's not clear, the compatible strings and any new bindings need to be documented. Rob