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Date:   Wed, 7 Feb 2018 12:56:06 +0530
From:   Viresh Kumar <viresh.kumar@linaro.org>
To:     Daniel Lezcano <daniel.lezcano@linaro.org>
Cc:     edubezval@gmail.com, kevin.wangtao@linaro.org, leo.yan@linaro.org,
        vincent.guittot@linaro.org, amit.kachhap@gmail.com,
        linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Javi Merino <javi.merino@kernel.org>,
        "open list:THERMAL" <linux-pm@vger.kernel.org>,
        daniel.thompson@linaro.org
Subject: Re: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu
 cooling device
Message-ID: <20180207072606.GO28462@vireshk-i7>
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On 06-02-18, 11:48, Daniel Lezcano wrote:
> On 06/02/2018 05:28, Viresh Kumar wrote:

> > Surely we can do one thing at a time if that's the way we choose to do it.
> 
> Easy to say :)
> 
> The current code is to introduce the feature without impacting the DT
> bindings in order to keep focused on the thermal mitigation aspect.
> 
> There are still a lot of improvements to do after that. You are
> basically asking me to implement the copy-on-write before the memory
> management is complete.

Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at
a time" if we choose to create a "combo device" (the way you proposed). I am not
trying to force you to solve all the problems in one go :)

> Can you give an example? Or your understanding is incorrect or I missed
> the point.

So I tried to write it down and realized I was assuming that different
cooling-maps can be provided for different cooling strategies
(cpufreq/cpuidle) and obviously that's not the case as its per device.
Not sure if it would be correct to explore the possibility of doing
that.

-- 
viresh