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Subject: Re: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu
 cooling device
To:     Viresh Kumar <viresh.kumar@linaro.org>
Cc:     edubezval@gmail.com, kevin.wangtao@linaro.org, leo.yan@linaro.org,
        vincent.guittot@linaro.org, amit.kachhap@gmail.com,
        linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Javi Merino <javi.merino@kernel.org>,
        "open list:THERMAL" <linux-pm@vger.kernel.org>,
        daniel.thompson@linaro.org
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 <20180207072606.GO28462@vireshk-i7>
From:   Daniel Lezcano <daniel.lezcano@linaro.org>
Message-ID: <93e62f8b-bba6-96e6-0011-84504041930a@linaro.org>
Date:   Wed, 7 Feb 2018 11:05:13 +0100
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On 07/02/2018 08:26, Viresh Kumar wrote:
> On 06-02-18, 11:48, Daniel Lezcano wrote:
>> On 06/02/2018 05:28, Viresh Kumar wrote:
> 
>>> Surely we can do one thing at a time if that's the way we choose to do it.
>>
>> Easy to say :)
>>
>> The current code is to introduce the feature without impacting the DT
>> bindings in order to keep focused on the thermal mitigation aspect.
>>
>> There are still a lot of improvements to do after that. You are
>> basically asking me to implement the copy-on-write before the memory
>> management is complete.
> 
> Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at
> a time" if we choose to create a "combo device" (the way you proposed). I am not
> trying to force you to solve all the problems in one go :)

Oh, ok :)

>> Can you give an example? Or your understanding is incorrect or I missed
>> the point.
> 
> So I tried to write it down and realized I was assuming that different
> cooling-maps can be provided for different cooling strategies
> (cpufreq/cpuidle) and obviously that's not the case as its per device.
> Not sure if it would be correct to explore the possibility of doing
> that.
> 


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