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[209.132.180.67]) by mx.google.com with ESMTP id h17si1286536pfj.178.2018.04.18.07.47.33; Wed, 18 Apr 2018 07:47:49 -0700 (PDT) Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67; Authentication-Results: mx.google.com; spf=pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1752712AbeDROo4 (ORCPT + 99 others); Wed, 18 Apr 2018 10:44:56 -0400 Received: from mga01.intel.com ([192.55.52.88]:24182 "EHLO mga01.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751431AbeDROoz (ORCPT ); Wed, 18 Apr 2018 10:44:55 -0400 X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from orsmga005.jf.intel.com ([10.7.209.41]) by fmsmga101.fm.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 18 Apr 2018 07:44:54 -0700 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.48,465,1517904000"; d="scan'208";a="217552705" Received: from unknown (HELO [10.249.234.107]) ([10.249.234.107]) by orsmga005.jf.intel.com with ESMTP; 18 Apr 2018 07:44:52 -0700 Message-ID: <1524062687.2553.15.camel@intel.com> Subject: Re: [GIT PULL V3] Thermal SoC management updates for v4.17-rc1 From: Zhang Rui To: Eduardo Valentin Cc: ACPI Devel Maling List , Linux PM , LKML Date: Wed, 18 Apr 2018 22:44:47 +0800 In-Reply-To: <20180418141027.GA3303@localhost.localdomain> References: <20180414183051.GA27921@localhost.localdomain> <1524037889.2553.13.camel@intel.com> <20180418141027.GA3303@localhost.localdomain> Content-Type: text/plain; charset="UTF-8" X-Mailer: Evolution 3.18.5.2-0ubuntu3.2 Mime-Version: 1.0 Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On 三, 2018-04-18 at 07:10 -0700, Eduardo Valentin wrote: > Hello, > > On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote: > > > > Hi, Eduardo, > > > > On 六, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote: > > > > > > Hello Linus, > > > > > > Please find thermal-soc changes for v4.17-rc1. > > > Rui asked me to send the pull request directly to you > > > as we are close to the end of the merge window. > > > Essentially this pull removes the series that caused > > > warning regression. I will work with the developer > > > to get that fixed later on, but I am still sending > > > the other few patches that are unrelated to that. > > > Let me know if this causes any issues and can still > > > be pulled. > > > > > > Changelog: > > > - New i.MX7 thermal sensor > > > - Mediatek driver now supports MT7622 SoC > > > - Removal of min max cpu cooling DT property > > > > > > Differences in V3: > > > - Rebased on top current linus/master, to avoid and merge issues > > > from previous pulled thermal code. > > > > > > Differences in V2: > > > - Reordered the patches to drop exynos changes for now until we > > > get > > > agreement on the fix on that driver for the compilation warns > > > caused by the confusing conversion functions. > > > > > > > > > The following changes since commit > > > 48023102b7078a6674516b1fe0d639669336049d: > > > > > >   Merge branch 'overlayfs-linus' of > > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018- > > > 04- > > > 13 16:55:41 -0700) > > > > > > are available in the git repository at: > > > > > >   git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux- > > > soc- > > > thermal linus > > > > > > for you to fetch changes up to > > > 15a32df1918259be6c23fc36014fc26ee66c836c: > > > > > >   dt-bindings: thermal: Remove "cooling-{min|max}-level" > > > properties > > > (2018-04-14 09:37:55 -0700) > > > > > This pull request does not catch this merge window. > > So do you want to split it into 2 separate pull requests, one for > > 4.17- > > rc and another for 4.18-rc1? > OK. Yeah, I am fine with that. > > > > > > > > > > > ---------------------------------------------------------------- > > > Anson Huang (1): > > >       thermal: imx: add i.MX7 thermal sensor support > > > > > > Bartlomiej Zolnierkiewicz (1): > > >       dt-bindings: thermal: remove no longer needed samsung > > > thermal > > > properties > > > > > > Sean Wang (2): > > >       dt-bindings: thermal: add binding for MT7622 SoC > > >       thermal: mediatek: add support for MT7622 SoC > > > > > > Viresh Kumar (1): > > >       dt-bindings: thermal: Remove "cooling-{min|max}-level" > > > properties > > > > > IMO, together with the refreshed exynos fixes, the one from Viresh > > and > > the one from Bartlomiej can be queued for 4.17-rc, and the others > > have > > to wait until next merge window. > > > Correct, the new chip support will need to wait for the next merge > window. I have already split the patches into the two categories. > The patches removing stuff are in my -fixes branch. All the other > adding > new chip support are in my -linus branch. > > Now, Do you have anything for this -rc2 ? If not, I will send > directly > to Linus the stuff in my -fixes branch. Let me know. > No, I don't have anything for -rc2. so please send pull request to Linux directly. thanks, rui