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Date:   Mon, 3 Sep 2018 12:20:22 +0200
From:   Maxime Ripard <maxime.ripard@bootlin.com>
To:     Icenowy Zheng <icenowy@aosc.io>
Cc:     Philipp Rossak <embed3d@gmail.com>, mark.rutland@arm.com,
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Subject: Re: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3
 thermal sensor
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On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
> Personally I suggest to leave out all SID or calibration related
> patches here.
>=20
> Currently we seems to be wrongly converting SID to big endian, however,
> the orgnization of the THS calibration data on H6 shows that it's
> surely little endian:
>=20
> It consists a temperature value in 1/10 celsuis as unit, and some
> thermal register readout values, which are the values read out at the
> given temperature, and every value here (the temperature and the
> readout) are all half word length.
>=20
> Let the temperature value be AABB, the two readout values be XXYY and
> ZZWW, the oragnization is:
> BB AA YY XX WW ZZ ** ** .
>=20
> When converting the SID to big endian, it becomes:
> XX YY AA BB ** ** ZZ WW ,
> which is non-sense, and not able to do sub-word cell addressing.
>=20
> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
> whether it will break compatibility.)

This is exposed to the userspace, so no.

Maxime
>=20

--=20
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com

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