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Date:   Thu, 6 Sep 2018 13:51:15 +0200
From:   Maxime Ripard <maxime.ripard@bootlin.com>
To:     Philipp Rossak <embed3d@gmail.com>
Cc:     Emmanuel Vadot <manu@bidouilliste.com>, lee.jones@linaro.org,
        robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org,
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Subject: Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
Message-ID: <20180906115114.inc6dhqhy47obo25@flea>
References: <20180830154518.29507-1-embed3d@gmail.com>
 <20180830154518.29507-28-embed3d@gmail.com>
 <20180904184623.e4386b8e6b657b1b25e90c09@bidouilliste.com>
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On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
> On 04.09.2018 18:46, Emmanuel Vadot wrote:
> > > +			/* Data cells */
> > > +			thermal_calibration: calib@234 {
> > > +				reg =3D <0x234 0x8>;
> > > +			};
> >   You are declaring 8 bytes of calibration data but to my knowledge it's
> > only 2 bytes per sensor, so 2 bytes for H3.
> >   Am I missing something ?
> >=20
> >   Thanks,
>=20
> Emmanuel you are right, it is 2 bytes per Sensor and should be 2 bytes for
> H3, but the thermal calibration data field is on all chips 64 bit wide - =
so
> 8 bytes. So I'm reading here the complete calibration data field.

Having one cell per channel would make more sense I guess.

Maxime

--=20
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com

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