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Subject: Re: [PATCH 11/11] hwmon/coretemp: Support multi-die/package
To:     Len Brown <lenb@kernel.org>, x86@kernel.org
Cc:     linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Len Brown <len.brown@intel.com>, linux-pm@vger.kernel.org,
        linux-hwmon@vger.kernel.org
References: <635b2bf8b1151a191cd9299276b75791a818c0c2.1550545163.git.len.brown@intel.com>
 <8ce75b95ef6105ebe5fb8c9e43b33f06516e3c16.1550545163.git.len.brown@intel.com>
From:   Guenter Roeck <linux@roeck-us.net>
Message-ID: <2e9ca4e1-d9ff-8f0c-c3c3-80f8b19bb7ee@roeck-us.net>
Date:   Tue, 19 Feb 2019 08:46:12 -0800
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On 2/18/19 7:40 PM, Len Brown wrote:
> From: Zhang Rui <rui.zhang@intel.com>
> 
> This patch introduces coretemp driver support
> for new dual-die/package systems.
> 
> On the new dual-die/package systems, the package temperature MSRs becomes
> die-scope. Thus instead of one hwmon device per physical package, now
> there should be one hwmon device for each die on these systems.
> 
> On the hardwares that do not have multi-die support,
> topology_unique_die_id() equals topology_physical_package_id(), thus the
> only difference is that physical package id is used as the coretemp
> platform device id, instead of logical package id on these systems.
> 
> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
> Signed-off-by: Len Brown <len.brown@intel.com>
> Cc: linux-pm@vger.kernel.org
> Cc: linux-hwmon@vger.kernel.org
> Signed-off-by: Len Brown <len.brown@intel.com>

Acked-by: Guenter Roeck <linux@roeck-us.net>

> ---
>   drivers/hwmon/coretemp.c | 9 +++++----
>   1 file changed, 5 insertions(+), 4 deletions(-)
> 
> diff --git a/drivers/hwmon/coretemp.c b/drivers/hwmon/coretemp.c
> index 5d34f7271e67..a0b6b2247c3a 100644
> --- a/drivers/hwmon/coretemp.c
> +++ b/drivers/hwmon/coretemp.c
> @@ -435,7 +435,7 @@ static int chk_ucode_version(unsigned int cpu)
>   
>   static struct platform_device *coretemp_get_pdev(unsigned int cpu)
>   {
> -	int pkgid = topology_logical_package_id(cpu);
> +	int pkgid = topology_unique_die_id(cpu);
>   
>   	if (pkgid >= 0 && pkgid < max_packages)
>   		return pkg_devices[pkgid];
> @@ -579,7 +579,7 @@ static struct platform_driver coretemp_driver = {
>   
>   static struct platform_device *coretemp_device_add(unsigned int cpu)
>   {
> -	int err, pkgid = topology_logical_package_id(cpu);
> +	int err, pkgid = topology_unique_die_id(cpu);
>   	struct platform_device *pdev;
>   
>   	if (pkgid < 0)
> @@ -703,7 +703,7 @@ static int coretemp_cpu_offline(unsigned int cpu)
>   	 * the rest.
>   	 */
>   	if (cpumask_empty(&pd->cpumask)) {
> -		pkg_devices[topology_logical_package_id(cpu)] = NULL;
> +		pkg_devices[topology_unique_die_id(cpu)] = NULL;
>   		platform_device_unregister(pdev);
>   		return 0;
>   	}
> @@ -732,6 +732,7 @@ static enum cpuhp_state coretemp_hp_online;
>   static int __init coretemp_init(void)
>   {
>   	int err;
> +	struct cpuinfo_x86 *c = &cpu_data(0);
>   
>   	/*
>   	 * CPUID.06H.EAX[0] indicates whether the CPU has thermal
> @@ -741,7 +742,7 @@ static int __init coretemp_init(void)
>   	if (!x86_match_cpu(coretemp_ids))
>   		return -ENODEV;
>   
> -	max_packages = topology_max_packages();
> +	max_packages = topology_max_packages() * c->x86_max_dies;
>   	pkg_devices = kcalloc(max_packages, sizeof(struct platform_device *),
>   			      GFP_KERNEL);
>   	if (!pkg_devices)
>