Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67;
From:   Len Brown <lenb@kernel.org>
To:     x86@kernel.org
Cc:     linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Len Brown <len.brown@intel.com>, linux-pm@vger.kernel.org,
        linux-hwmon@vger.kernel.org
Subject: [PATCH 11/14] hwmon/coretemp: Support multi-die/package
Date:   Tue, 26 Feb 2019 01:20:09 -0500
Message-Id: <b91ef931b054bacf5b4a34799560062615ff4e25.1551160674.git.len.brown@intel.com>
In-Reply-To: <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com>
References: <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com>
Reply-To: Len Brown <lenb@kernel.org>
Organization: Intel Open Source Technology Center
Sender: linux-kernel-owner@vger.kernel.org
Precedence: bulk

From: Zhang Rui <rui.zhang@intel.com>

This patch introduces coretemp driver support
for new dual-die/package systems.

On the new dual-die/package systems, the package temperature MSRs becomes
die-scope. Thus instead of one hwmon device per physical package, now
there should be one hwmon device for each die on these systems.

On the hardwares that do not have multi-die support,
topology_logical_die_id() equals topology_physical_package_id(), thus the
only difference is that physical package id is used as the coretemp
platform device id, instead of logical package id on these systems.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: linux-pm@vger.kernel.org
Cc: linux-hwmon@vger.kernel.org
---
 drivers/hwmon/coretemp.c | 9 +++++----
 1 file changed, 5 insertions(+), 4 deletions(-)

diff --git a/drivers/hwmon/coretemp.c b/drivers/hwmon/coretemp.c
index 5d34f7271e67..57f348d43819 100644
--- a/drivers/hwmon/coretemp.c
+++ b/drivers/hwmon/coretemp.c
@@ -435,7 +435,7 @@ static int chk_ucode_version(unsigned int cpu)
 
 static struct platform_device *coretemp_get_pdev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return pkg_devices[pkgid];
@@ -579,7 +579,7 @@ static struct platform_driver coretemp_driver = {
 
 static struct platform_device *coretemp_device_add(unsigned int cpu)
 {
-	int err, pkgid = topology_logical_package_id(cpu);
+	int err, pkgid = topology_logical_die_id(cpu);
 	struct platform_device *pdev;
 
 	if (pkgid < 0)
@@ -703,7 +703,7 @@ static int coretemp_cpu_offline(unsigned int cpu)
 	 * the rest.
 	 */
 	if (cpumask_empty(&pd->cpumask)) {
-		pkg_devices[topology_logical_package_id(cpu)] = NULL;
+		pkg_devices[topology_logical_die_id(cpu)] = NULL;
 		platform_device_unregister(pdev);
 		return 0;
 	}
@@ -732,6 +732,7 @@ static enum cpuhp_state coretemp_hp_online;
 static int __init coretemp_init(void)
 {
 	int err;
+	struct cpuinfo_x86 *c = &cpu_data(0);
 
 	/*
 	 * CPUID.06H.EAX[0] indicates whether the CPU has thermal
@@ -741,7 +742,7 @@ static int __init coretemp_init(void)
 	if (!x86_match_cpu(coretemp_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * c->x86_max_dies;
 	pkg_devices = kcalloc(max_packages, sizeof(struct platform_device *),
 			      GFP_KERNEL);
 	if (!pkg_devices)
-- 
2.18.0-rc0