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Date:   Fri, 5 Apr 2019 20:29:32 +0200 (CEST)
From:   Thomas Gleixner <tglx@linutronix.de>
To:     Len Brown <lenb@kernel.org>
cc:     x86@kernel.org, linux-kernel@vger.kernel.org,
        Zhang Rui <rui.zhang@intel.com>,
        Len Brown <len.brown@intel.com>
Subject: Re: [PATCH 09/14] thermal/x86_pkg_temp_thermal: Support
 multi-die/package
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References: <e2810a5317d3a109a98204e883fd1461f77b9339.1551160674.git.len.brown@intel.com> <863054888eb8f1a595369c49ec24740501e9c175.1551160674.git.len.brown@intel.com>
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On Tue, 26 Feb 2019, Len Brown wrote:
>  static int __init pkg_temp_thermal_init(void)
>  {
>  	int ret;
> +	struct cpuinfo_x86 *c = &cpu_data(0);
>  
>  	if (!x86_match_cpu(pkg_temp_thermal_ids))
>  		return -ENODEV;
>  
> -	max_packages = topology_max_packages();
> +	max_packages = topology_max_packages() * c->x86_max_dies;

This is really a sloppy hack. Just because cpuinfo is accessible it's not a
good idea to fiddle with it in a driver. We went great length to abstract
that stuff. So please add a new helper function topology_max_dies() and
retrieve it from that.

Thanks,

	tglx