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From:   Len Brown <lenb@kernel.org>
To:     x86@kernel.org
Cc:     linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Len Brown <len.brown@intel.com>
Subject: [PATCH 11/18] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date:   Wed,  1 May 2019 00:24:20 -0400
Message-Id: <e6a6fcd9ad6a1cb8da31d467277dd519eecdbd31.1556657368.git.len.brown@intel.com>
In-Reply-To: <6f53f0e494d743c79e18f6e3a98085711e6ddd0c.1556657368.git.len.brown@intel.com>
References: <6f53f0e494d743c79e18f6e3a98085711e6ddd0c.1556657368.git.len.brown@intel.com>
Reply-To: Len Brown <lenb@kernel.org>
Organization: Intel Open Source Technology Center
Sender: linux-kernel-owner@vger.kernel.org
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From: Zhang Rui <rui.zhang@intel.com>

Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can
expose multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
 drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
 1 file changed, 4 insertions(+), 4 deletions(-)

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..405b3858900a 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 	u32 tj_max, eax, ebx, ecx, edx;
 	struct pkg_device *pkgdev;
 	int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
 	 * worker will see the package anymore.
 	 */
 	if (lastcpu) {
-		packages[topology_logical_package_id(cpu)] = NULL;
+		packages[topology_logical_die_id(cpu)] = NULL;
 		/* After this point nothing touches the MSR anymore. */
 		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
 		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
 	if (!x86_match_cpu(pkg_temp_thermal_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	packages = kcalloc(max_packages, sizeof(struct pkg_device *),
 			   GFP_KERNEL);
 	if (!packages)
-- 
2.18.0-rc0