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From:   Len Brown <lenb@kernel.org>
To:     x86@kernel.org
Cc:     linux-kernel@vger.kernel.org, Zhang Rui <rui.zhang@intel.com>,
        Len Brown <len.brown@intel.com>, linux-pm@vger.kernel.org
Subject: [PATCH 10/22] powercap/intel_rapl: Support multi-die/package
Date:   Mon,  6 May 2019 17:26:05 -0400
Message-Id: <9f6958c231347e639e322de8d8c3de6859559345.1557177585.git.len.brown@intel.com>
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Reply-To: Len Brown <lenb@kernel.org>
Organization: Intel Open Source Technology Center
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From: Zhang Rui <rui.zhang@intel.com>

RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.

Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present.
No change on single die/package systems.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Cc: linux-pm@vger.kernel.org
---
 drivers/powercap/intel_rapl.c | 4 ++--
 1 file changed, 2 insertions(+), 2 deletions(-)

diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c
index 3c3c0c23180b..9202dbcef96d 100644
--- a/drivers/powercap/intel_rapl.c
+++ b/drivers/powercap/intel_rapl.c
@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package_domain(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp)
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;
 
-- 
2.18.0-rc0