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Date:   Thu, 15 Aug 2019 20:24:30 +0200
From:   Krzysztof Kozlowski <krzk@kernel.org>
To:     Sylwester Nawrocki <s.nawrocki@samsung.com>
Cc:     robh+dt@kernel.org, vireshk@kernel.org, devicetree@vger.kernel.org,
        kgene@kernel.org, pankaj.dubey@samsung.com,
        linux-samsung-soc@vger.kernel.org,
        linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org,
        linux-pm@vger.kernel.org, b.zolnierkie@samsung.com,
        m.szyprowski@samsung.com
Subject: Re: [PATCH v3 7/9] soc: samsung: Update the CHIP ID DT binding
 documentation
Message-ID: <20190815182430.GD14360@kozik-lap>
References: <20190813150827.31972-1-s.nawrocki@samsung.com>
 <CGME20190813150858eucas1p1a5fbf425753e4911c50631c3a6d34ffd@eucas1p1.samsung.com>
 <20190813150827.31972-8-s.nawrocki@samsung.com>
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On Tue, Aug 13, 2019 at 05:08:25PM +0200, Sylwester Nawrocki wrote:
> This patch adds documentation of a new optional "samsung,asv-bin"
> property in the chipid device node and documents requirement of
> "syscon" compatible string.  These additions are needed to support
> Exynos ASV (Adaptive Supply Voltage) feature.
> 
> Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
> ---
> Changes since v2:
>  - none
> 
> Changes since v1 (RFC):

Title should match bindings, so:
dt-bindings: samsung:

Also please put it before the driver change using these bindings.

Best regards,
Krzysztof