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charset="iso-8859-1" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 X-MS-Exchange-CrossTenant-Network-Message-Id: 2a1a2d69-357c-4a73-1fe3-08d7629c6238 X-MS-Exchange-CrossTenant-originalarrivaltime: 06 Nov 2019 09:33:30.1788 (UTC) X-MS-Exchange-CrossTenant-fromentityheader: Hosted X-MS-Exchange-CrossTenant-id: 70e1fb47-1155-421d-87fc-2e58f638b6e0 X-MS-Exchange-CrossTenant-mailboxtype: HOSTED X-MS-Exchange-CrossTenant-userprincipalname: jG5x9JpgnoT9WcWC8A9H04R3i0oXAxJAyP4NEZB62EzTrOB/zwfw6DGHm+H6mqjS34+KESnVVlkTsY2Pbh6sqQ== X-MS-Exchange-Transport-CrossTenantHeadersStamped: MN2PR18MB3165 X-OriginatorOrg: marvell.com X-Proofpoint-Virus-Version: vendor=fsecure engine=2.50.10434:6.0.95,18.0.572 definitions=2019-11-06_02:2019-11-06,2019-11-06 signatures=0 Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Update on CPER DIMM naming convention and DIMM ranks. Signed-off-by: Robert Richter Reviewed-by: Mauro Carvalho Chehab --- Documentation/admin-guide/ras.rst | 31 +++++++++++++++++++------------ 1 file changed, 19 insertions(+), 12 deletions(-) diff --git a/Documentation/admin-guide/ras.rst b/Documentation/admin-guide/= ras.rst index 2b20f5f7380d..26e02a59f0f4 100644 --- a/Documentation/admin-guide/ras.rst +++ b/Documentation/admin-guide/ras.rst @@ -330,9 +330,12 @@ There can be multiple csrows and multiple channels. =20 .. [#f4] Nowadays, the term DIMM (Dual In-line Memory Module) is widely used to refer to a memory module, although there are other memory - packaging alternatives, like SO-DIMM, SIMM, etc. Along this document, - and inside the EDAC system, the term "dimm" is used for all memory - modules, even when they use a different kind of packaging. + packaging alternatives, like SO-DIMM, SIMM, etc. The UEFI + specification (Version 2.7) defines a memory module in the Common + Platform Error Record (CPER) section to be an SMBIOS Memory Device + (Type 17). Along this document, and inside the EDAC system, the term + "dimm" is used for all memory modules, even when they use a + different kind of packaging. =20 Memory controllers allow for several csrows, with 8 csrows being a typical value. Yet, the actual number of csrows depends on the layout of @@ -349,12 +352,14 @@ controllers. The following example will assume 2 chan= nels: | | ``ch0`` | ``ch1`` | +=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D+=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D+= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D+ | ``csrow0`` | DIMM_A0 | DIMM_B0 | - +------------+ | | - | ``csrow1`` | | | + | | rank0 | rank0 | + +------------+ - | - | + | ``csrow1`` | rank1 | rank1 | +------------+-----------+-----------+ | ``csrow2`` | DIMM_A1 | DIMM_B1 | - +------------+ | | - | ``csrow3`` | | | + | | rank0 | rank0 | + +------------+ - | - | + | ``csrow3`` | rank1 | rank1 | +------------+-----------+-----------+ =20 In the above example, there are 4 physical slots on the motherboard @@ -374,11 +379,13 @@ which the memory DIMM is placed. Thus, when 1 DIMM is= placed in each Channel, the csrows cross both DIMMs. =20 Memory DIMMs come single or dual "ranked". A rank is a populated csrow. -Thus, 2 single ranked DIMMs, placed in slots DIMM_A0 and DIMM_B0 above -will have just one csrow (csrow0). csrow1 will be empty. On the other -hand, when 2 dual ranked DIMMs are similarly placed, then both csrow0 -and csrow1 will be populated. The pattern repeats itself for csrow2 and -csrow3. +In the example above 2 dual ranked DIMMs are similarly placed. Thus, +both csrow0 and csrow1 are populated. On the other hand, when 2 single +ranked DIMMs are placed in slots DIMM_A0 and DIMM_B0, then they will +have just one csrow (csrow0) and csrow1 will be empty. The pattern +repeats itself for csrow2 and csrow3. Also note that some memory +controller doesn't have any logic to identify the memory module, see +``rankX`` directories below. =20 The representation of the above is reflected in the directory tree in EDAC's sysfs interface. Starting in directory --=20 2.20.1