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From:   Daniel Lezcano <daniel.lezcano@linaro.org>
To:     edubezval@gmail.com, rui.zhang@intel.com
Cc:     rjw@rjwysocki.net, linux-pm@vger.kernel.org,
        viresh.kumar@linaro.org, amit.kucheria@linaro.org,
        linux-kernel@vger.kernel.org
Subject: [PATCH V4 4/4] thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
Date:   Wed,  4 Dec 2019 16:39:30 +0100
Message-Id: <20191204153930.9128-4-daniel.lezcano@linaro.org>
In-Reply-To: <20191204153930.9128-1-daniel.lezcano@linaro.org>
References: <20191204153930.9128-1-daniel.lezcano@linaro.org>
Sender: linux-kernel-owner@vger.kernel.org
Precedence: bulk

As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
---
  V4:
    - Added Acked-by and Reviewed-by
  V3:
    - Fix missing name conversion (Viresh Kumar)
---
 Documentation/driver-api/thermal/exynos_thermal.rst  | 2 +-
 MAINTAINERS                                          | 2 +-
 drivers/thermal/Makefile                             | 2 +-
 drivers/thermal/clock_cooling.c                      | 2 +-
 drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++---
 include/linux/clock_cooling.h                        | 2 +-
 6 files changed, 8 insertions(+), 8 deletions(-)
 rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%)

diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst
index 5bd556566c70..d4e4a5b75805 100644
--- a/Documentation/driver-api/thermal/exynos_thermal.rst
+++ b/Documentation/driver-api/thermal/exynos_thermal.rst
@@ -67,7 +67,7 @@ TMU driver description:
 The exynos thermal driver is structured as::
 
 					Kernel Core thermal framework
-				(thermal_core.c, step_wise.c, cpu_cooling.c)
+				(thermal_core.c, step_wise.c, cpufreq_cooling.c)
 								^
 								|
 								|
diff --git a/MAINTAINERS b/MAINTAINERS
index d2e92a0360f2..26e4be914765 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -16194,7 +16194,7 @@ L:	linux-pm@vger.kernel.org
 S:	Supported
 F:	Documentation/driver-api/thermal/cpu-cooling-api.rst
 F:	Documentation/driver-api/thermal/cpu-idle-cooling.rst
-F:	drivers/thermal/cpu_cooling.c
+F:	drivers/thermal/cpufreq_cooling.c
 F:	drivers/thermal/cpuidle_cooling.c
 F:	include/linux/cpu_cooling.h
 
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 9c8aa2d4bd28..5c98472ffd8b 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE)	+= user_space.o
 thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR)	+= power_allocator.o
 
 # cpufreq cooling
-thermal_sys-$(CONFIG_CPU_FREQ_THERMAL)	+= cpu_cooling.o
+thermal_sys-$(CONFIG_CPU_FREQ_THERMAL)	+= cpufreq_cooling.o
 thermal_sys-$(CONFIG_CPU_IDLE_THERMAL)	+= cpuidle_cooling.o
 
 # clock cooling
diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c
index 3ad3256c48fd..7cb3ae4b44ee 100644
--- a/drivers/thermal/clock_cooling.c
+++ b/drivers/thermal/clock_cooling.c
@@ -7,7 +7,7 @@
  *  Copyright (C) 2013	Texas Instruments Inc.
  *  Contact:  Eduardo Valentin <eduardo.valentin@ti.com>
  *
- *  Highly based on cpu_cooling.c.
+ *  Highly based on cpufreq_cooling.c.
  *  Copyright (C) 2012	Samsung Electronics Co., Ltd(http://www.samsung.com)
  *  Copyright (C) 2012  Amit Daniel <amit.kachhap@linaro.org>
  */
diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c
similarity index 99%
rename from drivers/thermal/cpu_cooling.c
rename to drivers/thermal/cpufreq_cooling.c
index 6b9865c786ba..3a3f9cf94b6d 100644
--- a/drivers/thermal/cpu_cooling.c
+++ b/drivers/thermal/cpufreq_cooling.c
@@ -1,6 +1,6 @@
 // SPDX-License-Identifier: GPL-2.0
 /*
- *  linux/drivers/thermal/cpu_cooling.c
+ *  linux/drivers/thermal/cpufreq_cooling.c
  *
  *  Copyright (C) 2012	Samsung Electronics Co., Ltd(http://www.samsung.com)
  *
@@ -694,7 +694,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
 	u32 capacitance = 0;
 
 	if (!np) {
-		pr_err("cpu_cooling: OF node not available for cpu%d\n",
+		pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
 		       policy->cpu);
 		return NULL;
 	}
@@ -705,7 +705,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
 
 		cdev = __cpufreq_cooling_register(np, policy, capacitance);
 		if (IS_ERR(cdev)) {
-			pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
+			pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
 			       policy->cpu, PTR_ERR(cdev));
 			cdev = NULL;
 		}
diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h
index b5cebf766e02..4b0a69863656 100644
--- a/include/linux/clock_cooling.h
+++ b/include/linux/clock_cooling.h
@@ -7,7 +7,7 @@
  *  Copyright (C) 2013	Texas Instruments Inc.
  *  Contact:  Eduardo Valentin <eduardo.valentin@ti.com>
  *
- *  Highly based on cpu_cooling.c.
+ *  Highly based on cpufreq_cooling.c.
  *  Copyright (C) 2012	Samsung Electronics Co., Ltd(http://www.samsung.com)
  *  Copyright (C) 2012  Amit Daniel <amit.kachhap@linaro.org>
  */
-- 
2.17.1