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Subject: Re: [Patch v4 0/7] Introduce Power domain based warming device driver
To:     rui.zhang@intel.com, ulf.hansson@linaro.org,
        daniel.lezcano@linaro.org, bjorn.andersson@linaro.org,
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References: <1574254593-16078-1-git-send-email-thara.gopinath@linaro.org>
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From:   Thara Gopinath <thara.gopinath@linaro.org>
Message-ID: <5E174086.50004@linaro.org>
Date:   Thu, 9 Jan 2020 10:02:30 -0500
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On 11/20/2019 07:56 AM, Thara Gopinath wrote:
> Certain resources modeled as a generic power domain in linux kernel can be
> used to warm up the SoC (mx power domain on sdm845) if the temperature
> falls below certain threshold. These power domains can be considered as
> thermal warming devices.  (opposite of thermal cooling devices).
> 
> In kernel, these warming devices can be modeled as a thermal cooling
> device. Since linux kernel today has no instance of a resource modeled as
> a power domain acting as a thermal warming device, a generic power domain
> based thermal warming device driver that can be used pan-Socs is the
> approach taken in this patch series. Since thermal warming devices can be
> thought of as the mirror opposite of thermal cooling devices, this patch
> series re-uses thermal cooling device framework. To use these power
> domains as warming devices require further tweaks in the thermal framework
> which are out of scope of this patch series. These tweaks have been posted
> as a separate series[1].
Hi,

Can this series be merged ? It has been acked from DT and genpd point of
view.

Warm Regards
Thara