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[209.132.180.67]) by mx.google.com with ESMTP id l8si3286640oii.249.2020.03.05.04.57.10; Thu, 05 Mar 2020 04:57:22 -0800 (PST) Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67; Authentication-Results: mx.google.com; dkim=pass header.i=@linaro.org header.s=google header.b=kEFjk2FJ; spf=pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=pass (p=NONE sp=NONE dis=NONE) header.from=linaro.org Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1726269AbgCEM4v (ORCPT + 99 others); Thu, 5 Mar 2020 07:56:51 -0500 Received: from mail-pf1-f175.google.com ([209.85.210.175]:37685 "EHLO mail-pf1-f175.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726251AbgCEM4u (ORCPT ); Thu, 5 Mar 2020 07:56:50 -0500 Received: by mail-pf1-f175.google.com with SMTP id p14so2746973pfn.4 for ; Thu, 05 Mar 2020 04:56:49 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=Dprw7ZFMCDJrSnYhVdBa1Xg6BNbV4uRfUelp4S9rGA0=; b=kEFjk2FJuT0bTqOB47M1X5eP6R8OteYtR4JIWqXJuOgVb8iPKklyX/l9optB/f2RF9 ZFPrFzSdZB1QoolioWMI3bQpTQhbGDIeyPjt0qAOoVa0PB5Vnis3oqlGPIWkgosKd2td xA1MwoIGNLL1F/iJgQK1cQvlXRf9UR+gbexWXIpby6u/wkDksjvuDSSCc+QR5H/QvdAc 2fpxGieTanfotI8/fE5Zq9eDbUvuc+tTO/NcuEY+hycugklihEUVvL4dvfAAJQOqtBZX DRFuoOfElyCHL2m0u4AqlKswio203EqZ5A0lUPw93fDT2jKOq2WvCL5ae2kpTR1MTG9o PWNQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=Dprw7ZFMCDJrSnYhVdBa1Xg6BNbV4uRfUelp4S9rGA0=; b=JM/ampC5H0DCWnCo9J9n11vqOEQlZPQ7e0YpetaBFdKKXD48d2lsQ023NPSjCOtR7V OaOXFnkOTrYAB2T5ELyLUMflw11QrAgg995z1JSpz9aE8x4rtfdXRtgWMRE2mDi66wE6 ol1PmJCNDW5n2tlCo94V3I97dakaONIteDypRsNL+eJjarrsWWLRfd0yGjdzC+8yKX3a Luwt5tlrhkPXuy2dseFPIzXW4mTZYCmdnPR1pikd/4ZwR0R47kfHCzCywY9SyRLe3CO8 CmsRgkNdzSRv13TXelXTAdWU1t1T0/nASy0ChHdYo4lX/FLsap9YSsswM3PO8J7oMrGp DUjg== X-Gm-Message-State: ANhLgQ3PhUu636u3ioGzNH0M1EB0D2Wr2vZJsC9YtRQaCOCGK/A2vIgX 9ye5CWhfJsD/y8tJDdTwqzYEm7599E0= X-Received: by 2002:aa7:97b4:: with SMTP id d20mr8372466pfq.62.1583413008653; Thu, 05 Mar 2020 04:56:48 -0800 (PST) Received: from localhost ([103.195.202.216]) by smtp.gmail.com with ESMTPSA id 13sm31824464pfi.78.2020.03.05.04.56.46 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Thu, 05 Mar 2020 04:56:47 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: devicetree@vger.kernel.org, linux-pm@vger.kernel.org Subject: [PATCH v2 0/3] Convert thermal bindings to yaml Date: Thu, 5 Mar 2020 18:26:40 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 MIME-Version: 1.0 Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Hi all, Here is a series splitting up the thermal bindings into 3 separate bindings in YAML, one each of the sensor, cooling-device and the thermal zones. Since I was learning about YAML parsers while creating these bindings, there are bound to be some issues. Changes since v1: - Addressed review comments from Rob - Moved the license back to GPLv2, waiting for other authors to give permission to relicense to BSD-2-Clause as well - Fixed up warnings thrown by dt_binding_check I have to add that the bindings as they exist today, don't really follow the "describe the hardware" model of devicetree. e.g. the entire thermal-zone binding is a software abstraction to tie arbitrary, board-specific trip points to cooling strategies. This doesn't fit well into the model where the same SoC in two different form-factor devices e.g. mobile and laptop, will have fairly different thermal profiles and might benefit from different trip points and mitigation heuristics. I've started some experiments with moving the thermal zone data to a board-specific platform data that is used to initialise a "thermal zone driver". In any case, if we ever move down that path, it'll probably end up being v2 of the binding, so this series is still relevant. Please help review. Regards, Amit Amit Kucheria (3): dt-bindings: thermal: Add yaml bindings for thermal sensors dt-bindings: thermal: Add yaml bindings for thermal cooling-devices dt-bindings: thermal: Add yaml bindings for thermal zones .../thermal/thermal-cooling-devices.yaml | 114 ++++++ .../bindings/thermal/thermal-sensor.yaml | 72 ++++ .../bindings/thermal/thermal-zones.yaml | 325 ++++++++++++++++++ 3 files changed, 511 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml -- 2.20.1