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[209.132.180.67]) by mx.google.com with ESMTP id b10si3131106oic.153.2020.03.05.04.57.34; Thu, 05 Mar 2020 04:57:46 -0800 (PST) Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67; Authentication-Results: mx.google.com; dkim=pass header.i=@linaro.org header.s=google header.b=EHt4DAgG; spf=pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=pass (p=NONE sp=NONE dis=NONE) header.from=linaro.org Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1726563AbgCEM5A (ORCPT + 99 others); Thu, 5 Mar 2020 07:57:00 -0500 Received: from mail-pl1-f196.google.com ([209.85.214.196]:45537 "EHLO mail-pl1-f196.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726520AbgCEM5A (ORCPT ); Thu, 5 Mar 2020 07:57:00 -0500 Received: by mail-pl1-f196.google.com with SMTP id b22so2598884pls.12 for ; Thu, 05 Mar 2020 04:56:59 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=YPje9xcPYfIamEpUGoSH/TcUKQBJFPYwji3i7uk9SdI=; b=EHt4DAgGtc8ZWbbUms/Azd5KsSQkQH56Vwm8e9HTZaNCV+GsiFiy3wkfP5ymusF9FR q0c9pXbn2AcjIXTcxk2jNH4DAbYGqdRx2oQNY5Amh84vt9TRg/0GNanxvEUn4tb2YIKM +dvpOYTDs70oZiZ7dRe6W63hbHfh1nue/w/p0hUj8vX+qNLcFnQu6Ad5iGdPp4/IPGAf pjxLSUBkWc761aiD10tMXEOSFPCW5SE7O4WB5Qyc8eqtWIrLpK+K1TxFV4gk4qgKlZHU JAoj7XtOgIATfwwruZ8DQD4qWdT8URKd+LIsSbLG+59717l7WjnfhsnyEGzj1WK0DgIT 5sXA== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=YPje9xcPYfIamEpUGoSH/TcUKQBJFPYwji3i7uk9SdI=; b=ss2KCoB5RPuAEmi0F5D/OGmMS32BSqFHHNDUDl+Qht8376BCRYX8Iq3MUGXcigxg43 SZtSJAKRG8FCLR9zUYJETyOH17vA1IBwl/vj90daHbdDI4KSGbB6kUtZ5GhGf1UHLK3M XWJQbenog6XRDf+kAx938MA2sX+zqXbbzq0L3BzVGEw5NSr+5AbxNmnLYyK3ZeSespre Xm94ucgDkWKRUI+lcFNRFGNiCIfLJkN4BWBFAlBwVkgfQ67g4BQIljVd/5bOapcO2Q0P 8txinGjMKGpv6PSKpoPoEGoxfToemusK1jsLrpl9nqGnQOCB+Qu1UkokaZtzy3Bn5Si/ sURg== X-Gm-Message-State: ANhLgQ0vNurRj4B5qirjV6nXNQr9Pnc17GYn5bx0rT203DP74uKAnsBF w5/QOpY1kSxuOQv+LLn9i6faWzWt5Q4= X-Received: by 2002:a17:90a:bf09:: with SMTP id c9mr7953201pjs.96.1583413016741; Thu, 05 Mar 2020 04:56:56 -0800 (PST) Received: from localhost ([103.195.202.216]) by smtp.gmail.com with ESMTPSA id r12sm32030259pgu.93.2020.03.05.04.56.55 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Thu, 05 Mar 2020 04:56:55 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [PATCH v2 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Date: Thu, 5 Mar 2020 18:26:42 +0530 Message-Id: <9a2052ee2afa43048bd4e2594d015fca6bbf5116.1583412540.git.amit.kucheria@linaro.org> X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. cpus, gpus) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria --- .../thermal/thermal-cooling-devices.yaml | 114 ++++++++++++++++++ 1 file changed, 114 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 0000000000000..4745ea4b41ae7 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,114 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include + #include + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + }; +... -- 2.20.1