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[209.132.180.67]) by mx.google.com with ESMTP id y9si10890402oia.47.2020.03.24.23.35.26; Tue, 24 Mar 2020 23:35:38 -0700 (PDT) Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67; Authentication-Results: mx.google.com; dkim=pass header.i=@linaro.org header.s=google header.b=CKVkfHoj; spf=pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=pass (p=NONE sp=NONE dis=NONE) header.from=linaro.org Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1726313AbgCYGfD (ORCPT + 99 others); Wed, 25 Mar 2020 02:35:03 -0400 Received: from mail-pg1-f181.google.com ([209.85.215.181]:33667 "EHLO mail-pg1-f181.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726206AbgCYGfD (ORCPT ); Wed, 25 Mar 2020 02:35:03 -0400 Received: by mail-pg1-f181.google.com with SMTP id d17so692199pgo.0 for ; Tue, 24 Mar 2020 23:35:01 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=XDUtIM4paHW0qOUeTkKt8AFyM+VSRp0AScAk260LK2s=; b=CKVkfHoj/nZYW3irz1TY3+48Q6839881dDZMIU45L1EzcFqwV35P6C6D5VXZbnAfkI tu5oq99VfrqvYMrRTwHB+ffrmsUeO73kq5AywG8YIxrLJCU2JQ/m4mjDnhLIzlbXAzG5 SRjKCWBaMUvDV2WOmQ4X6Q+w+Y9osPekTs/ID/BqAvIoLpSOxc4HnScud9yLgNY22BV3 XhTQUN0ixUIwXaFqK8DGM6gfhGPLErBzVqy3pfNHNisbhISiExCGQI7vp9FMuVZt4C0C 1SSrq1Tf/01TtmFIebam6DXTtX0/R7oIq+0/GGSm9kuQOxGawvfTylFbGYn01s8Kc9fv mqaQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=XDUtIM4paHW0qOUeTkKt8AFyM+VSRp0AScAk260LK2s=; b=HyHJde99RstlberoOB8OoppiP9TQhvHqzpPnDigIleGUMPFaeIutdWUCk52bGeDGJ+ k6msfqbPF+sA20QZApdlX3X1Mkv46/mtdapfiCFJTl80miSqW9rptN6Ehc5x8c/NFwCb FON/Mb4FGa4pdSc2LrbSCW4HrlXgf4tad0AAw2CwZ7yis0PZ5FTx9IwunPXBw8f2LFNM tiGvRnzDwWcW4ux+ixxOdqWPiRNuvPXKQeyI34HxrfFWsmjcxdV5vNmHEJydTpmq97kx fTturtwZUBrSYULFesT42BlUB6ZUSdemC9LDiXTbZPB/cLiQ9/X+ldC9fbWVjgQ+ZDw0 9E9w== X-Gm-Message-State: ANhLgQ0jetYxJ/2/YmfvfeUl+g+gjuAJCqEnfJN6cxKfq4MwvoK7n03l q+AVzpTsf34zuGGT+kjVmXQsh7kx6b8= X-Received: by 2002:a63:da4d:: with SMTP id l13mr1705064pgj.216.1585118100212; Tue, 24 Mar 2020 23:35:00 -0700 (PDT) Received: from localhost ([103.195.202.71]) by smtp.gmail.com with ESMTPSA id d26sm4059263pfo.37.2020.03.24.23.34.57 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Tue, 24 Mar 2020 23:34:58 -0700 (PDT) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: devicetree@vger.kernel.org, linux-pm@vger.kernel.org Subject: [PATCH v3 0/3] Convert thermal bindings to yaml Date: Wed, 25 Mar 2020 12:04:51 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 MIME-Version: 1.0 Content-Transfer-Encoding: 8bit Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Hi all, Here is a series splitting up the thermal bindings into 3 separate bindings in YAML, one each of the sensor, cooling-device and the thermal zones. A series to remove thermal.txt and change over all references to it will follow shortly. Another series to fixup problems found by enforcing this yaml definition across dts files will also follow. Changes since v2: - Addressed review comment from Rob - Added required properties for thermal-zones node - Added select: true to thermal-cooling-devices.yaml - Fixed up example to pass dt_binding_check Changes since v1: - Addressed review comments from Rob - Moved the license back to GPLv2, waiting for other authors to give permission to relicense to BSD-2-Clause as well - Fixed up warnings thrown by dt_binding_check I have to add that the bindings as they exist today, don't really follow the "describe the hardware" model of devicetree. e.g. the entire thermal-zone binding is a software abstraction to tie arbitrary, board-specific trip points to cooling strategies. This doesn't fit well into the model where the same SoC in two different form-factor devices e.g. mobile and laptop, will have fairly different thermal profiles and might benefit from different trip points and mitigation heuristics. I've started some experiments with moving the thermal zone data to a board-specific platform data that is used to initialise a "thermal zone driver". In any case, if we ever move down that path, it'll probably end up being v2 of the binding, so this series is still relevant. Please help review. Regards, Amit Amit Kucheria (3): dt-bindings: thermal: Add yaml bindings for thermal sensors dt-bindings: thermal: Add yaml bindings for thermal cooling-devices dt-bindings: thermal: Add yaml bindings for thermal zones .../thermal/thermal-cooling-devices.yaml | 116 +++++++ .../bindings/thermal/thermal-sensor.yaml | 72 ++++ .../bindings/thermal/thermal-zones.yaml | 324 ++++++++++++++++++ 3 files changed, 512 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml -- 2.20.1