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[209.132.180.67]) by mx.google.com with ESMTP id d22si5556451oti.316.2020.03.29.15.54.18; Sun, 29 Mar 2020 15:54:30 -0700 (PDT) Received-SPF: pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) client-ip=209.132.180.67; Authentication-Results: mx.google.com; dkim=pass header.i=@linaro.org header.s=google header.b=IpzvSj93; spf=pass (google.com: best guess record for domain of linux-kernel-owner@vger.kernel.org designates 209.132.180.67 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=pass (p=NONE sp=NONE dis=NONE) header.from=linaro.org Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1729232AbgC2WHK (ORCPT + 99 others); Sun, 29 Mar 2020 18:07:10 -0400 Received: from mail-wr1-f66.google.com ([209.85.221.66]:39728 "EHLO mail-wr1-f66.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1728986AbgC2WHK (ORCPT ); Sun, 29 Mar 2020 18:07:10 -0400 Received: by mail-wr1-f66.google.com with SMTP id p10so18935498wrt.6 for ; Sun, 29 Mar 2020 15:07:07 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references; bh=xqOYJnZwZ6nCjA/xlHPb8mgZN2nsbbT0ZoaYXOpkuLo=; b=IpzvSj93LGGqfX/pEFFDBqxz2oGLAVMgMH+pkbxOXiDK3OPs3SQPYdJcwOKRpS564O i+wJZiYEEeFnPD2EvGnsCDiamlX74r9xB6Lx7U6Q2qXLf+s3OIglehymhCdGKilxWPNR 9UuCACT3A1A/y4s+ZwsfvyLtaJyOrvLadae5e8LiPn8MBha7ofJ+J7wCd3HwOgR/k3a8 TK12ZIohUYrUq+KCqnZptjCVYDyNodp8QClv9BmnekHASLRc8Q4g8Kr2J9bkgXeqXmmJ dKORQNKnbqMjlNejrNub2lzQR2GxGJMNaPh0FY2SeLs1eT2eytNJqQlBJWxki7XLFbz9 tnug== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references; bh=xqOYJnZwZ6nCjA/xlHPb8mgZN2nsbbT0ZoaYXOpkuLo=; b=KeqgoK/1p6wlw7vm4HugjFaxJyk/NeIpegie4+N0vpfMvPVUwQCtVTmPyccdKtIjjG w5BFCSEdFbO+kLQInXl28RLE4nP6le/hobbD6iF9kraANfq6KQPbz6Clhj+egTQhz43i zStg93w5D7tziKjhuglnCPMq7JfZ5erQzS73iwq4U1Dn2BSXCAUKxpQEgZ+20O68qm+3 PX4rpwTzX2bNzZK3e7CiIm7R61L2WqNpbwttG5IasjkHAYp3DwfeGwHp50W1qrp1AkH5 t7Je2CdLalUn+7mAJbZpbVYB5PW49yNkINCcoCZ7RQihRgsWWv5NuXAMQf3o9RsMrIc2 Xsog== X-Gm-Message-State: ANhLgQ19jTSmaTQ8jVuiFNm6+PQNGj3rLf003LPBJ2eNXHG+mKNUciTl KUedN5/5E6ITdfCSJqKVQ5p57w== X-Received: by 2002:adf:9465:: with SMTP id 92mr11523032wrq.122.1585519626825; Sun, 29 Mar 2020 15:07:06 -0700 (PDT) Received: from localhost.localdomain ([2a01:e34:ed2f:f020:78b1:4459:6959:42d0]) by smtp.gmail.com with ESMTPSA id j188sm20026740wmj.36.2020.03.29.15.07.05 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 29 Mar 2020 15:07:06 -0700 (PDT) From: Daniel Lezcano To: rafael@kernel.org, robh@kernel.org Cc: daniel.lezcano@linaro.org, Zhang Rui , Amit Kucheria , Rob Herring , Mark Rutland , linux-pm@vger.kernel.org (open list:THERMAL), devicetree@vger.kernel.org (open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS), linux-kernel@vger.kernel.org (open list) Subject: [PATCH 2/4] dt-bindings: thermal: Add the idle cooling device Date: Mon, 30 Mar 2020 00:03:18 +0200 Message-Id: <20200329220324.8785-2-daniel.lezcano@linaro.org> X-Mailer: git-send-email 2.17.1 In-Reply-To: <20200329220324.8785-1-daniel.lezcano@linaro.org> References: <20200329220324.8785-1-daniel.lezcano@linaro.org> Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Some devices are not able to cool down by reducing their voltage / frequency because it could be not available or the system does not allow voltage scaling. In this configuration, it is not possible to use this strategy and the idle injection cooling device can be used instead. One idle cooling device is now present for the CPU as implemented by the combination of the idle injection framework belonging to the power capping framework and the thermal cooling device. The missing part is the DT binding providing a way to describe how the cooling device will work on the system. A first iteration was done by making the cooling device to point to the idle state. Unfortunately it does not make sense because it would need to duplicate the idle state description for each CPU in order to have a different phandle and make the thermal internal framework happy. It was proposed to add an cooling-cells to <3>, unfortunately the thermal framework is expecting a value of <2> as stated by the documentation and it is not possible from the cooling device generic code to loop this third value to the back end cooling device. Another proposal was to add a child 'thermal-idle' node as the SCMI does. This approach allows to have a self-contained configuration for the idle cooling device without colliding with the cpufreq cooling device which is based on the CPU node. In addition, it allows to have the cpufreq cooling device and the idle cooling device to co-exist together as showed in the example. Signed-off-by: Daniel Lezcano --- .../bindings/thermal/thermal-idle.yaml | 145 ++++++++++++++++++ 1 file changed, 145 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml new file mode 100644 index 000000000000..f9f59cfa3c36 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml @@ -0,0 +1,145 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal idle cooling device binding + +maintainers: + - Daniel Lezcano + +description: | + The thermal idle cooling device allows the system to passively + mitigate the temperature on the device by injecting idle cycles, + forcing it to cool down. + + This binding describes the thermal idle node. + +properties: + $nodename: + const: thermal-idle + description: | + A /thermal-idle node describes the idle cooling device properties to + cool down efficiently the attached thermal zone. + + '#cooling-cells': + const: 2 + description: | + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + + duration: + $ref: /schemas/types.yaml#/definitions/uint32 + description: | + The idle duration in microsecond the device begins to cool down. + + latency: + $ref: /schemas/types.yaml#/definitions/uint32 + description: | + The exit latency constraint in microsecond for the injected + idle state for the device. + +required: + - '#cooling-cells' + +examples: + - | + #include + + // Example: Combining idle cooling device on big CPUs with cpufreq cooling device + cpus { + #address-cells = <2>; + #size-cells = <0>; + + /* ... */ + + cpu_b0: cpu@100 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x100>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + idle-thermal { + #cooling-cells = <2>; + duration = <10000>; + latency = <500>; + }; + }; + + cpu_b1: cpu@101 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x101>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + idle-thermal { + #cooling-cells = <2>; + duration = <10000>; + latency = <500>; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal_zones { + cpu_thermal: cpu { + polling-delay-passive = <100>; + polling-delay = <1000>; + + /* ... */ + + trips { + cpu_alert0: cpu_alert0 { + temperature = <65000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert1: cpu_alert1 { + temperature = <70000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert2: cpu_alert2 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit: cpu_crit { + temperature = <95000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert1>; + cooling-device = <&{/cpus/cpu@100/idle-thermal} 0 15 >, + <&{/cpus/cpu@101/idle-thermal} 0 15>; + }; + + map1 { + trip = <&cpu_alert2>; + cooling-device = + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>, + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; + }; -- 2.17.1