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Date:   Tue, 31 Mar 2020 15:16:05 -0600
From:   Rob Herring <robh@kernel.org>
To:     Amit Kucheria <amit.kucheria@linaro.org>
Cc:     linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org,
        swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org,
        Amit Kucheria <amit.kucheria@verdurent.com>,
        Zhang Rui <rui.zhang@intel.com>, linux-pm@vger.kernel.org,
        devicetree@vger.kernel.org
Subject: Re: [PATCH v3 2/3] dt-bindings: thermal: Add yaml bindings for
 thermal cooling-devices
Message-ID: <20200331211605.GA3795@bogus>
References: <cover.1585117436.git.amit.kucheria@linaro.org>
 <1ee4240e29edefc36b5d410d4792971c2bb4c5d5.1585117436.git.amit.kucheria@linaro.org>
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On Wed, 25 Mar 2020 12:04:53 +0530, Amit Kucheria wrote:
> As part of moving the thermal bindings to YAML, split it up into 3
> bindings: thermal sensors, cooling devices and thermal zones.
> 
> The property #cooling-cells is required in each device that acts as a
> cooling device - whether active or passive. So any device that can
> throttle its performance to passively reduce heat dissipation (e.g.
> cpus, gpus) and any device that can actively dissipate heat at different
> levels (e.g. fans) will contain this property.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
> ---
>  .../thermal/thermal-cooling-devices.yaml      | 116 ++++++++++++++++++
>  1 file changed, 116 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> 

Reviewed-by: Rob Herring <robh@kernel.org>