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Subject: Re: [PATCH v6 0/4] thermal: k3: Add support for bandgap sensors
To:     Daniel Lezcano <daniel.lezcano@linaro.org>, <rui.zhang@intel.com>,
        <robh+dt@kernel.org>, <t-kristo@ti.com>
CC:     <amit.kucheria@verdurent.com>, <devicetree@vger.kernel.org>,
        <linux-kernel@vger.kernel.org>,
        <linux-arm-kernel@lists.infradead.org>, <linux-pm@vger.kernel.org>,
        <mark.rutland@arm.com>
References: <20200407055116.16082-1-j-keerthy@ti.com>
 <3c69e3c6-5549-e891-fde6-95a2ecc49f77@linaro.org>
From:   "J, KEERTHY" <j-keerthy@ti.com>
Message-ID: <0817f9ee-c72f-3e9f-00cf-e8ddaf608020@ti.com>
Date:   Thu, 9 Apr 2020 19:37:38 +0530
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On 4/9/2020 7:19 PM, Daniel Lezcano wrote:
> 
> Hi Keerthy,
> 
> On 07/04/2020 07:51, Keerthy wrote:
>> Add VTM thermal support. In the Voltage Thermal
>> Management Module(VTM), K3 AM654 supplies a voltage
>> reference and a temperature sensor feature that are gathered in the band
>> gap voltage and temperature sensor (VBGAPTS) module. The band
>> gap provides current and voltage reference for its internal
>> circuits and other analog IP blocks. The analog-to-digital
>> converter (ADC) produces an output value that is proportional
>> to the silicon temperature.
>>
>> Add support for bandgap sensors. Currently reading temperatures
>> is supported.
> 
> How do you want to proceed? Shall I take patches 1 & 2 ?

+Tero

Hi Tero,

Can you pull 3 & 4? Or Daniel can take all 4?

- Keerthy

> 
> 
>> Changes in v6:
>>
>>    * Removed bunch of unused #defines and couple of redundant variables.
>>    * Reordered patches a bit.
>>    * Minor reordering in dt binding patch.
>>
>> Changes in v5:
>>
>>    * Removed thermal work function which was unused.
>>    * Removed unused preve_tenmp and a couple more struct variables.
>>    * Removed couple of redundant header function include.
>>
>> Changes in v4:
>>
>>    * Fixed comments from Daniel to remove trend function.
>>    * Mostly cleaned up all the unused variables.
>>    * Driver from bool to tristate.
>>
>> Changes in v3:
>>
>>    * Fixed errors seen with:
>>      dt_binding_check DT_SCHEMA_FILES=Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>
>> Changes in v2:
>>
>>    * Fixed yaml errors
>>    * renamed am654-industrial-thermal.dtsi to k3-am654-industrial-thermal.dtsi
>>      to follow the convention for k3 family.
>>
>> Keerthy (4):
>>    dt-bindings: thermal: k3: Add VTM bindings documentation
>>    thermal: k3: Add support for bandgap sensors
>>    arm64: dts: ti: am65-wakeup: Add VTM node
>>    arm64: dts: ti: am654: Add thermal zones
>>
>>   .../bindings/thermal/ti,am654-thermal.yaml    |  56 ++++
>>   arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi    |  11 +
>>   .../dts/ti/k3-am654-industrial-thermal.dtsi   |  45 +++
>>   drivers/thermal/Kconfig                       |  10 +
>>   drivers/thermal/Makefile                      |   1 +
>>   drivers/thermal/k3_bandgap.c                  | 264 ++++++++++++++++++
>>   6 files changed, 387 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
>>   create mode 100644 arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi
>>   create mode 100644 drivers/thermal/k3_bandgap.c
>>
> 
>