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Subject: Re: [PATCH 00/14] thermal core include cleanups
To:     Amit Kucheria <amit.kucheria@linaro.org>,
        linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org,
        Amit Daniel Kachhap <amit.kachhap@gmail.com>,
        Amit Kucheria <amit.kucheria@verdurent.com>,
        Javi Merino <javi.merino@kernel.org>,
        Viresh Kumar <viresh.kumar@linaro.org>,
        Zhang Rui <rui.zhang@intel.com>
Cc:     linux-pm@vger.kernel.org
References: <cover.1589199124.git.amit.kucheria@linaro.org>
From:   Daniel Lezcano <daniel.lezcano@linaro.org>
Message-ID: <2c065bae-06a5-e63c-4e01-be62dabe8890@linaro.org>
Date:   Fri, 22 May 2020 18:49:30 +0200
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On 11/05/2020 14:24, Amit Kucheria wrote:
> I noticed some remnants from when thermal core could be modular. While
> cleaning that up, I fixed up the includes to be sorted alphabetically and
> included export.h in files that were using EXPORT_SYMBOL* or THIS_MODULE
> while at the same time removing inclusion of module.h from core files.
> 
> Finally, the names of the source files for the governors and core have some
> inconsistencies and the last couple of patches rename them.
> 
> Build and boot tested on some ARM boards.

Series applied, thanks !

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