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[23.128.96.18]) by mx.google.com with ESMTP id j5si9619401ejm.468.2020.05.25.13.00.00; Mon, 25 May 2020 13:00:30 -0700 (PDT) Received-SPF: pass (google.com: domain of linux-kernel-owner@vger.kernel.org designates 23.128.96.18 as permitted sender) client-ip=23.128.96.18; Authentication-Results: mx.google.com; spf=pass (google.com: domain of linux-kernel-owner@vger.kernel.org designates 23.128.96.18 as permitted sender) smtp.mailfrom=linux-kernel-owner@vger.kernel.org; dmarc=fail (p=NONE sp=NONE dis=NONE) header.from=intel.com Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S2390823AbgEYNmX (ORCPT + 99 others); Mon, 25 May 2020 09:42:23 -0400 Received: from mga17.intel.com ([192.55.52.151]:52678 "EHLO mga17.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S2390752AbgEYNmW (ORCPT ); Mon, 25 May 2020 09:42:22 -0400 IronPort-SDR: 2mJyGc4DUto9zzv9PPlx+qHEoNf7SXkxytbVXHQI6WdSWdqRx70LB0pGUKNdEP/xWVJfxooaFt DCJ72WqDfqKg== X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from fmsmga006.fm.intel.com ([10.253.24.20]) by fmsmga107.fm.intel.com with ESMTP/TLS/ECDHE-RSA-AES256-GCM-SHA384; 25 May 2020 06:42:20 -0700 IronPort-SDR: 3ahJSY+WGJJJL30AHT0RjfuA8GbpndCYboJhLj5auNonIf3UK1WzfXVbmt5TsM2f+/YaVPBve3 c8UhP5cU6vZw== X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.73,433,1583222400"; d="scan'208";a="468055300" Received: from smile.fi.intel.com (HELO smile) ([10.237.68.40]) by fmsmga006.fm.intel.com with ESMTP; 25 May 2020 06:42:17 -0700 Received: from andy by smile with local (Exim 4.93) (envelope-from ) id 1jdDMx-008nMy-GZ; Mon, 25 May 2020 16:42:19 +0300 Date: Mon, 25 May 2020 16:42:19 +0300 From: Andy Shevchenko To: Jarkko Nikula Cc: Serge Semin , Serge Semin , Mika Westerberg , Alexey Malahov , Thomas Bogendoerfer , Paul Burton , Ralf Baechle , Rob Herring , Frank Rowand , linux-mips@vger.kernel.org, devicetree@vger.kernel.org, Wolfram Sang , "Rafael J. Wysocki" , Hanjun Guo , Hans de Goede , linux-kernel@vger.kernel.org, linux-i2c@vger.kernel.org Subject: Re: [PATCH v2 08/12] i2c: designware: Introduce platform drivers glue layer interface Message-ID: <20200525134219.GB1634618@smile.fi.intel.com> References: <20200306132001.1B875803087C@mail.baikalelectronics.ru> <20200510095019.20981-1-Sergey.Semin@baikalelectronics.ru> <20200510095019.20981-9-Sergey.Semin@baikalelectronics.ru> <4950bb1e-302f-947e-1924-452a8169b504@linux.intel.com> <20200521023735.mja62ujmxebgwyef@mobilestation> <80cf1d67-5de1-f3f1-27a0-b88cc105b228@linux.intel.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <80cf1d67-5de1-f3f1-27a0-b88cc105b228@linux.intel.com> Organization: Intel Finland Oy - BIC 0357606-4 - Westendinkatu 7, 02160 Espoo Sender: linux-kernel-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Mon, May 25, 2020 at 04:16:05PM +0300, Jarkko Nikula wrote: > On 5/21/20 5:37 AM, Serge Semin wrote: > For this patchset I'd like more if changes are done to > i2c-designware-platdrv.c since it's not too complicated yet :-) And after moving ACPI stuff to common code, the one has even been shrunk significantly. > If it starts to look too messy in the future then it's time split I think. -- With Best Regards, Andy Shevchenko