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Date:   Thu, 10 Sep 2020 20:01:52 +0200
From:   Andreas Kemnade <andreas@kemnade.info>
To:     Adam Ford <aford173@gmail.com>
Cc:     linux-pm@vger.kernel.org, aford@beaconembedded.com,
        hns@goldelico.com, kernel test robot <lkp@intel.com>,
        Tony Lindgren <tony@atomide.com>,
        Russell King <linux@armlinux.org.uk>,
        Eduardo Valentin <edubezval@gmail.com>,
        Keerthy <j-keerthy@ti.com>, Zhang Rui <rui.zhang@intel.com>,
        Daniel Lezcano <daniel.lezcano@linaro.org>,
        Amit Kucheria <amitk@kernel.org>, linux-omap@vger.kernel.org,
        linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH V2 1/2] thermal: ti-soc-thermal: Enable addition power
 management
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In-Reply-To: <20200819125925.2119434-1-aford173@gmail.com>
References: <20200819125925.2119434-1-aford173@gmail.com>
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On Wed, 19 Aug 2020 07:59:23 -0500
Adam Ford <aford173@gmail.com> wrote:

> The bandgap sensor can be idled when the processor is too, but it
> isn't currently being done, so the power consumption of OMAP3
> boards can elevated if the bangap sensor is enabled.
> 
> This patch attempts to use some additional power management
> to idle the clock to the bandgap when not needed.
> 
> Signed-off-by: Adam Ford <aford173@gmail.com>
> Reported-by: kernel test robot <lkp@intel.com>
> ---
> V2: Fix issue where variable stating the suspend mode isn't being
>     properly set and cleared.
> 
hmm, it is not in linux-next. Can we expect that for v5.10?

Regards,
Andreas