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From:   kholk11@gmail.com
To:     bjorn.andersson@linaro.org
Cc:     robh+dt@kernel.org, agross@kernel.org, georgi.djakov@linaro.org,
        kholk11@gmail.com, marijns95@gmail.com, konradybcio@gmail.com,
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Subject: [PATCH 0/2] Add SDM630/636/660 interconnect driver
Date:   Sat, 26 Sep 2020 14:50:59 +0200
Message-Id: <20200926125101.12712-1-kholk11@gmail.com>
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From: AngeloGioacchino Del Regno <kholk11@gmail.com>

This patch series adds the SDM660 interconnect provider driver in
order to stop some timeouts and achieve some decent performance by
avoiding to be NoC limited.
It's also providing some power consumption improvement, but I have
only measured that as less heat, which is quite important when
working on thermally constrained devices like smartphones.

This patch series has been tested against the following devices:
 - Sony Xperia XA2 Ultra (SDM630 Nile Discovery)
 - Sony Xperia 10        (SDM630 Ganges Kirin)
 - Sony Xperia 10 Plus   (SDM636 Ganges Mermaid)

AngeloGioacchino Del Regno (2):
  interconnect: qcom: Add SDM660 interconnect provider driver
  dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC

 .../bindings/interconnect/qcom,sdm660.yaml    | 146 +++
 drivers/interconnect/qcom/Kconfig             |   9 +
 drivers/interconnect/qcom/Makefile            |   2 +
 drivers/interconnect/qcom/sdm660.c            | 919 ++++++++++++++++++
 .../dt-bindings/interconnect/qcom,sdm660.h    | 116 +++
 5 files changed, 1192 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/interconnect/qcom,sdm660.yaml
 create mode 100644 drivers/interconnect/qcom/sdm660.c
 create mode 100644 include/dt-bindings/interconnect/qcom,sdm660.h

-- 
2.28.0