Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org Received: from vger.kernel.org (vger.kernel.org [23.128.96.18]) by smtp.lore.kernel.org (Postfix) with ESMTP id 850B7C433EF for ; Thu, 2 Dec 2021 06:38:53 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1345319AbhLBGmO (ORCPT ); Thu, 2 Dec 2021 01:42:14 -0500 Received: from alexa-out.qualcomm.com ([129.46.98.28]:55571 "EHLO alexa-out.qualcomm.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1345329AbhLBGl6 (ORCPT ); Thu, 2 Dec 2021 01:41:58 -0500 DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=quicinc.com; i=@quicinc.com; q=dns/txt; s=qcdkim; t=1638427117; x=1669963117; h=from:to:cc:subject:date:message-id; bh=3g+eUVzpsgrN7jH+hXE6d4OUhX4I1HGrua57aZsyv40=; b=AiinRTEwOGXL4q3gWfmI+K3LdpojXP1YjijcEI7WlsmgRnzSLWdsvO8u HwfrB/N8KF9bbqeZK9p5JH6BP5WVPZ+rJtBLJR6tMHHmcVrqO4+xNWwhk zChEpoMzQpQrU2fdhIqx4Vj1owi31nNNBvjG0gFm1BmHGtUgDpwaOZYK6 I=; Received: from ironmsg07-lv.qualcomm.com ([10.47.202.151]) by alexa-out.qualcomm.com with ESMTP; 01 Dec 2021 22:38:35 -0800 X-QCInternal: smtphost Received: from ironmsg01-blr.qualcomm.com ([10.86.208.130]) by ironmsg07-lv.qualcomm.com with ESMTP/TLS/AES256-SHA; 01 Dec 2021 22:38:34 -0800 X-QCInternal: smtphost Received: from c-sbhanu-linux.qualcomm.com ([10.242.50.201]) by ironmsg01-blr.qualcomm.com with ESMTP; 02 Dec 2021 12:08:16 +0530 Received: by c-sbhanu-linux.qualcomm.com (Postfix, from userid 2344807) id 8FBEF48F7; Thu, 2 Dec 2021 12:08:15 +0530 (IST) From: Shaik Sajida Bhanu To: tudor.ambarus@microchip.com, michael@walle.cc, p.yadav@ti.com, miquel.raynal@bootlin.com, richard@nod.at, vigneshr@ti.com, linux-mtd@lists.infradead.org, linux-kernel@vger.kernel.org Cc: stummala@codeaurora.org, vbadigan@codeaurora.org, quic_rampraka@quicinc.com, quic_pragalla@quicinc.com, sartgarg@codeaurora.org, Shaik Sajida Bhanu Subject: [PATCH V2] mtd: spi-nor: winbond: Add support for winbond chip Date: Thu, 2 Dec 2021 12:08:12 +0530 Message-Id: <1638427092-9139-1-git-send-email-quic_c_sbhanu@quicinc.com> X-Mailer: git-send-email 2.7.4 Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Add support for winbond W25Q512NW-IM chip. Signed-off-by: Shaik Sajida Bhanu --- Changes since V1: Added space before name of the flash part as suggested by Doug. --- drivers/mtd/spi-nor/winbond.c | 3 +++ 1 file changed, 3 insertions(+) diff --git a/drivers/mtd/spi-nor/winbond.c b/drivers/mtd/spi-nor/winbond.c index 96573f6..44f19f2 100644 --- a/drivers/mtd/spi-nor/winbond.c +++ b/drivers/mtd/spi-nor/winbond.c @@ -100,6 +100,9 @@ static const struct flash_info winbond_parts[] = { SECT_4K | SPI_NOR_DUAL_READ | SPI_NOR_QUAD_READ) }, { "w25m512jv", INFO(0xef7119, 0, 64 * 1024, 1024, SECT_4K | SPI_NOR_QUAD_READ | SPI_NOR_DUAL_READ) }, + { "w25q512nw", INFO(0xef8020, 0, 64 * 1024, 1024, + SECT_4K | SPI_NOR_DUAL_READ | SPI_NOR_QUAD_READ | + SPI_NOR_HAS_LOCK | SPI_NOR_HAS_TB) }, { "w25q512jvq", INFO(0xef4020, 0, 64 * 1024, 1024, SECT_4K | SPI_NOR_DUAL_READ | SPI_NOR_QUAD_READ) }, }; -- QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation