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Date:   Wed, 15 Dec 2021 14:10:19 -0600
From:   Rob Herring <robh@kernel.org>
To:     Luca Weiss <luca.weiss@fairphone.com>
Cc:     Konrad Dybcio <konrad.dybcio@somainline.org>,
        Rob Herring <robh+dt@kernel.org>,
        ~postmarketos/upstreaming@lists.sr.ht,
        linux-arm-msm@vger.kernel.org,
        Bjorn Andersson <bjorn.andersson@linaro.org>,
        Amit Kucheria <amitk@kernel.org>, linux-kernel@vger.kernel.org,
        "Rafael J. Wysocki" <rafael@kernel.org>,
        Zhang Rui <rui.zhang@intel.com>, devicetree@vger.kernel.org,
        Thara Gopinath <thara.gopinath@linaro.org>,
        Daniel Lezcano <daniel.lezcano@linaro.org>,
        linux-pm@vger.kernel.org, phone-devel@vger.kernel.org,
        Andy Gross <agross@kernel.org>
Subject: Re: [PATCH 05/10] dt-bindings: thermal: tsens: Add SM6350 compatible
Message-ID: <YbpLqwFJI/nfvxd9@robh.at.kernel.org>
References: <20211213082614.22651-1-luca.weiss@fairphone.com>
 <20211213082614.22651-6-luca.weiss@fairphone.com>
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On Mon, 13 Dec 2021 09:26:06 +0100, Luca Weiss wrote:
> Add devicetree compatible for tsens on SM6350 SoC.
> 
> Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
> Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@kernel.org>