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Date:   Mon, 2 May 2022 19:34:54 -0500
From:   Rob Herring <robh@kernel.org>
To:     Keerthy <j-keerthy@ti.com>
Cc:     kristo@kernel.org, amitk@kernel.org, devicetree@vger.kernel.org,
        robh+dt@kernel.org, krzysztof.kozlowski@linaro.org,
        linux-kernel@vger.kernel.org, rui.zhang@intel.com,
        daniel.lezcano@linaro.org, vigneshr@ti.com,
        linux-pm@vger.kernel.org
Subject: Re: [PATCH v6 1/4] dt-bindings: thermal: k3-j72xx: Add VTM bindings
 documentation
Message-ID: <YnB4rtn87l5nXtRM@robh.at.kernel.org>
References: <20220427064635.24898-1-j-keerthy@ti.com>
 <20220427064635.24898-2-j-keerthy@ti.com>
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On Wed, 27 Apr 2022 12:16:32 +0530, Keerthy wrote:
> Add VTM bindings documentation. In the Voltage Thermal
> Management Module(VTM), K3 J72XX supplies a voltage
> reference and a temperature sensor feature that are gathered in the band
> gap voltage and temperature sensor (VBGAPTS) module. The band
> gap provides current and voltage reference for its internal
> circuits and other analog IP blocks. The analog-to-digital
> converter (ADC) produces an output value that is proportional
> to the silicon temperature.
> 
> Signed-off-by: Keerthy <j-keerthy@ti.com>
> ---
>  .../bindings/thermal/ti,j72xx-thermal.yaml    | 64 +++++++++++++++++++
>  1 file changed, 64 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml
> 

Reviewed-by: Rob Herring <robh@kernel.org>