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Message-ID: <a372bd7b-d3c3-ad85-11b2-cde23e2f397d@linaro.org>
Date:   Tue, 3 May 2022 13:36:40 +0200
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Subject: Re: [PATCH v2 1/5] dt-bindings: thermal: tsens: Add ipq8074
 compatible
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To:     Robert Marko <robimarko@gmail.com>, agross@kernel.org,
        bjorn.andersson@linaro.org, amitk@kernel.org, rafael@kernel.org,
        daniel.lezcano@linaro.org, rui.zhang@intel.com, robh+dt@kernel.org,
        krzysztof.kozlowski+dt@linaro.org, linux-arm-msm@vger.kernel.org,
        linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
        linux-kernel@vger.kernel.org
References: <20220501182200.47328-1-robimarko@gmail.com>
From:   Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
In-Reply-To: <20220501182200.47328-1-robimarko@gmail.com>
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On 01/05/2022 20:21, Robert Marko wrote:
> Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
> only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
> 
> We also have to make sure that correct interrupts are set according to
> compatibles, so populate interrupt information per compatibles.
> 
> Signed-off-by: Robert Marko <robimarko@gmail.com>

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof